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cooling module

A heat dissipation module and heat sink technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of difficult heat dissipation efficiency of the heat sink and the inability to increase the volume of the heat sink infinitely, and achieve simple structure, convenient installation, and replacement hot full effect

Active Publication Date: 2018-06-29
嘉善县魏塘资产管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the size of the case, the volume of the radiator cannot be increased infinitely
Therefore, how to improve the heat dissipation efficiency of the radiator in a limited space has become a very big problem

Method used

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Embodiment Construction

[0024] see figure 1 , in a preferred embodiment of the present invention, a heat dissipation module 100 is used to dissipate heat from an electronic component (not shown in the figure), and the heat dissipation module 100 includes a heat sink 10, an auxiliary mechanism 20 and several The heat pipe 50 connecting the heat sink 10 and the auxiliary mechanism 20 .

[0025] The heat sink 10 includes a base plate 11 and a heat dissipation portion 15 , and the heat dissipation portion 15 is fixed on one side of the base plate 11 . Several fasteners 111 are arranged around the substrate 11 , and the fasteners 111 can fix the heat sink 10 and the electronic components together. The substrate 11 is closely attached to the electronic components to absorb heat generated by the electronic components. The heat pipe 50 is filled with a plurality of cooling liquids, the heat pipes 50 are inserted into the substrate 11 , and the cooling liquid absorbs the heat conducted to the substrate 11 ....

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Abstract

A heat dissipation module is used to dissipate heat from an electronic component. The heat dissipation module includes a radiator and a plurality of heat pipes that are closely attached to the electronic component. Both the radiator and the heat pipes are equipped with Cooling liquid, the heat dissipation module also includes a fin group for accommodating the heat pipe, the fin group includes a number of fins and a wind deflector rotatably mounted on the fins, the fins are placed on the fins A number of ventilation holes are opened on the air plate, and when the cooling liquid absorbs the heat generated by the electronic components and enters the fin set through the heat pipe, the air deflector can rotate to allow airflow to pass through the air holes so that The air flow is more fully in contact with the heat pipes in the fins to accelerate the heat dissipation of the cooling liquid in the heat pipes.

Description

technical field [0001] The invention relates to a cooling module, in particular to a cooling module for cooling electronic components. Background technique [0002] At present, with the increasing popularity of computers, their functions become more and more powerful, and the corresponding electronic components generate more and more heat. It is difficult for traditional radiators to solve the corresponding heat dissipation problems. For this reason, some manufacturers use larger radiators to dissipate heat from electronic components. However, due to the limitation of the size of the case, the volume of the radiator cannot be infinitely increased. Therefore, how to improve the heat dissipation efficiency of the radiator in a limited space has become a very big problem. Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation module with a simple structure and better heat dissipation effect. [0004] A heat dissipation module...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/467
Inventor 范永昌
Owner 嘉善县魏塘资产管理有限公司