Unlock instant, AI-driven research and patent intelligence for your innovation.

Small-sized light emitting diode (LED) chip and fabrication method thereof

An LED chip and manufacturing method technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient light-emitting area, failure of light-emitting layer to emit light, affecting the light-emitting efficiency of small LED chips, etc., so as to improve light-emitting efficiency and reduce contact area effect

Inactive Publication Date: 2016-06-22
FOCUS LIGHTINGS SCI & TECH
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the size of small LED chips can be 6*6mil or even smaller, while the minimum diameter of the two metal electrodes in the LED chip is 2.4mil. Luminous efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Small-sized light emitting diode (LED) chip and fabrication method thereof
  • Small-sized light emitting diode (LED) chip and fabrication method thereof
  • Small-sized light emitting diode (LED) chip and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0042] In the present invention, a small LED chip refers to an LED chip with a smaller size. In the following embodiments, an LED chip with a size of 6*6mil is used as an example for illustration. In other embodiments, it may also be an LED chip with a smaller size.

[0043] ginseng figure 1 Shown is a schematic cross-sectional structu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a small-sized light-emitting diode (LED) chip and a fabrication method thereof. The LED chip comprises a substrate, an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer, wherein a through hole is formed in the LED chip and passes through the P-type semiconductor layer, the light-emitting layer and a part of the N-type semiconductor layer, a transparent conductive layer which does not cover a through hole region is formed on the P-type semiconductor layer, a current blocking layer is formed on the side wall of the through hole and a part of the transparent conductive layer aside the through hole, an N electrode is formed on the current blocking layer and in the through hole and is electrically connected with the N-type semiconductor layer, a P electrode is formed on the transparent conductive layer and is electrically connected with the P-type semiconductor layer, a substrate is a patterned substrate, and the N electrode is a reflective electrode. With the arrangement of the current blocking layer and the electrodes, the contact area between the N electrode and the N-type semiconductor layer is reduced, and a part of the light emitting layer below the N electrode can give out light; and the reflective electrode and the PSS substrate are used for emergent light, and thus, the luminous efficiency of the small-sized LED chip is effectively improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting devices, in particular to a small LED chip and a manufacturing method thereof. Background technique [0002] A light-emitting diode (Light-EmittingDiode, LED) is a semiconductor electronic component that can emit light. This kind of electronic component appeared as early as 1962. In the early days, it could only emit low-brightness red light. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the brightness has also increased to a considerable level. brightness. The use has also been used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, decoration and lighting. [0003] The preparation of LED chips usually includes the following steps: [0004] 1) Mu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/14H01L33/20H01L33/38H01L33/40H01L33/00
CPCH01L33/145H01L33/0066H01L33/0075H01L33/20H01L33/382H01L33/405
Inventor 李庆张广庚吴红斌陈立人
Owner FOCUS LIGHTINGS SCI & TECH