System and method for multistation cooperation preparation of flexible electronics

Abstract

The invention discloses a system and a method for multistation cooperation preparation of flexible electronics. The system comprises a rotating disc module, and a substrate loading and unloading module, a base electro-spraying module, a bottom-layer insulating layer 3D print module, an electrospinning module, a top-layer insulating layer 3D print module, a laser peeling module and a material fetching module, which are distributed at the periphery of the rotating disc module, wherein the rotating disc module is used for fixing substrates and converting stations; the substrate loading and unloading module is used for picking and transferring substrates; the base electro-spraying module is used for preparing bases; the bottom-layer and top-layer insulating layer 3D print modules are separately used for printing bottom-layer and top-layer insulating layers; the electrospinning module is used for spinning circuits; the laser peeling module is used for ablating bases and automatically separating substrates from flexible electronics; and the material fetching module is used for fetching separated flexible electronics from substrates. The method utilizes the system to carry out the multistation cooperation preparation of flexible electronics. The whole set of system can be cyclically used, and is high in production efficiency, low in cost and high in precision.

Description

technical field [0001] The invention belongs to the field of flexible device manufacturing, and more specifically relates to a multi-station coordinated flexible electronic manufacturing system and method. Background technique [0002] Flexible Electronics (Flexible Electronics) is a general term for a technology, also known as plastic electronics, printed electronics, organic electronics, etc. Flexible electronics can be summarized as an emerging electronic technology that manufactures electronic devices made of organic or inorganic materials on flexible, ductile plastic or thin metal substrates. Medical, national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes (OLEDs), printed RFID, thin-film solar panels, and electronic skin patches (SkinPatches). [0003] Like traditional IC technology, manufacturing process and equipment are also the main driving force for the development of flexible electro...

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Problems solved by technology

In recent years, the rapid development of flexible electronic devices and wearable devices has led to the continuous expansion of the demand for flexible electronics. Traditional preparation methods have been difficult to meet the increasing demand. popular research sites

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