Control method of laminator, control system of laminator and laminator

Abstract

The invention provides a laminator control method, a laminator control system and a laminator. The laminator control method comprises selecting a lamination mode according to a thickness value acquired by a thickness measurement device for lamination processing of a circuit board. The technical scheme of the invention can be used for intelligent lamination processing of the circuit board to be laminated while avoiding the selection of the circuit board before the lamination, the lamination efficiency of the circuit board is improved, and meanwhile the lamination cost for the circuit board is also reduced.

Description

technical field [0001] The present invention relates to the technical field of laminators, in particular, to a control method of a laminator, a control system of a laminator, and a laminator. Background technique [0002] At present, with the coverage and application of electronic products and communication technologies, printed circuit board technology has also developed rapidly. Its main development history is: traditional multilayer circuit boards, high-density interconnect Interconnection (ELIC, Every Layer interconnection) HDI boards, the development trend of printed circuit boards is gradually developing in the direction of lighter, thinner and smaller. In the current application of circuit boards, the development of thin circuit boards has become the mainstream of the market, so the process precision of thin circuit boards has become the technical benchmark of the industry. In the process of making circuit board graphic lines, it is necessary to make inner and outer ...

AI Technical Summary

Problems solved by technology

Since the thickness of the copper-clad substrate of the thin plate is about 0.10mm, or even 0.05mm, if the ordinary lamination shaft is used to laminate the thin-plate circuit board before the graphic circuit is made, the flatness of the copper-clad substrate will be affected, and a thin plate is required. The plate lamination shaft performs additional lamination processing on the thin circuit board to ensure its accuracy and quality, while the circuit board of ordinary thickness does not need the lamination process of the thin plate lamination shaft to meet the accuracy and quality requirements of the circuit board. This requires the lamination workers to set different lamination modes according to the thickness of the circuit board before each lamination, which reduces the production efficiency of the circuit board lamination process.

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