Novel computer mainboard cooler

Abstract

The invention relates to a novel computer mainboard cooler. The cooler comprises a nano-crystal column, an aluminum sleeve and cooling fins, wherein the nano-crystal column is located in the aluminum sleeve and coaxial with the aluminum sleeve; the aluminum sleeve is closely connected with the nano-crystal column; the cooling fins are uniformly arranged in the circumferential direction of the aluminum sleeve, located at the periphery of the aluminum sleeve and integrally formed with the aluminum sleeve; the bottom end of the nano-crystal column is in contact with a mainboard; and an exhaust fan is mounted at the other end of the nano-crystal column. The cooler has the advantages that the cooling speed is high, heat of the mainboard is ensured to be dissipated as quickly as possible to the maximum extent, and the service life of the mainboard is prolonged; and the nano-crystal column and the aluminum sleeve are closely matched together by adopting a hot-pressing process, so that the heat transfer and dissipation effects are ensured and the potential safety hazards are avoided.

Description

technical field [0001] The invention relates to a radiator for a computer mainboard, which is used for heat dissipation of the computer mainboard. Background technique [0002] Traditional computer motherboards have a simple structure of radiator heat pipes, only cooling fins for heat dissipation, and the cooling effect is not ideal. When the motherboard is working for a long time, it is easy to cause the motherboard to overheat and cause burnout, which affects the normal use of the computer. [0003] In addition, in order to improve the heat dissipation effect, heat dissipation liquid water is added to ensure the timely absorption and loss of heat. However, due to the insecurity of water, if leakage occurs, it will easily cause damage to the computer and shorten the service life of the computer. Contents of the invention [0004] In order to overcome the defects of the prior art, the invention provides a novel radiator for computer motherboards. The technical solution of...

AI Technical Summary

Problems solved by technology

[0002] The structure of the heat sink of the traditional computer motherboard is simple, only the heat dissipation fins are used for heat dissipation, and the heat dissipation effect is not ideal. When the motherboard works for a long time, it is easy to cause the motherboard to overheat and cause burnout, which affects the normal use of the computer.

[0003] In addition, in order to improve the heat dissipation effect, heat dissipation liquid water is added to ensure the timely absorption and loss of heat. However, due to the insecurity of water, if leakage occurs, it will easily cause damage to the computer and shorten the service life of the computer.

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