Three-dimensional holographic imaging safety inspection system and method thereof

一种三维全息、安检的技术，应用在三维全息成像的安检系统领域，能够解决实现成本高、人体安检系统结构复杂、成像图像分辨率低等问题，达到降低系统成本、成像结果清晰、分辨率高的效果

Active Publication Date: 2016-07-13
SHENZHEN CCT THZ TECH CO LTD
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Problems solved by technology

[0005] It can be seen that the existing millimeter-wave active 3D holographic imaging human body security inspection system has a complex structure and high implementation costs; and the two sets of scanning units perform scanning and information transmission and reception independently, and there is a problem of low resolution of the imaging image

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  • Three-dimensional holographic imaging safety inspection system and method thereof
  • Three-dimensional holographic imaging safety inspection system and method thereof
  • Three-dimensional holographic imaging safety inspection system and method thereof

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] figure 2 It is a schematic structural diagram of a three-dimensional holographic imaging security inspection system of an embodiment; the three-dimensional holographic imaging security inspection system of this embodiment includes a main body frame 1, and an area to be scanned 10 and at least two The scanning area is characterized in that it also includes: a millimeter wave transceiver module 2, at least two groups of millimeter wave switch antenna arrays, a scanning drive device 5, and a parallel image processing module 4; the number of the millimeter wave switch antenna arrays is related ...

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Abstract

The invention relates to a three-dimensional holographic imaging safety inspection system and a method thereof. The system comprises a main body framework, a millimeter-wave transmit-receive module arranged on the main body framework, at least two groups of millimeter wave switch antenna arrays connected to the millimeter-wave transmit-receive module, a scanning and driving device used for driving the at least two groups of millimeter wave switch antenna arrays to rotate homonymously, a control device used for making the scanning and driving device generate a rotation angle signal and a parallel image processing module, wherein the number of the millimeter wave switch antenna arrays is the same with the number of scanning areas; and the parallel image processing module is used for synthesizing a three-dimensional holographic image of a tested object according to an echo signal collected by the millimeter-wave transmit-receive module and space position information corresponding to the echo signal. By using the system and the method, a system structure is simplified and acquired imaging resolution is high.

Description

technical field [0001] The invention relates to the technical field of millimeter wave imaging, in particular to a security inspection system and method for three-dimensional holographic imaging. Background technique [0002] Millimeter waves have frequencies from 30GHz to 300GHz (wavelengths from 1mm to 10mm). In the electromagnetic spectrum, the position of millimeter wave frequency is between infrared and microwave. The millimeter wave imaging system mainly has the following characteristics: it is sensitive to the shape and structure of the target, and has a strong ability to distinguish metal targets from the background environment; the obtained image has high resolution, so it can improve the ability to identify and detect targets; compared with infrared laser , millimeter waves are less affected by harsh natural environments, and can be used in harsh environments such as smoke, clouds, and fog; the system is small in size and light in weight. Compared with microwave c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S13/90G01S13/88G01S7/03G01V8/00
CPCG01S7/03G01S13/887G01S13/90G01V8/005G01S13/9088H01Q21/00
Inventor 孙超祁春超吴光胜赵术开丁庆
Owner SHENZHEN CCT THZ TECH CO LTD
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