Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A modeling method of human skin spectrum and a mathematical modeling method of multiple skin parameters with high degree of fitting

A modeling method and skin technology, applied in the field of computational biology, can solve the problems of not fully reflecting the actual skin, not considering horizontal scattering, and unable to fit the wave band

Active Publication Date: 2017-02-22
陈威
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of model is mainly used for skin rendering, emphasizing visual effects, and accuracy is not a key indicator. Therefore, there are problems in using it for quantitative analysis of skin parameters: ①There are few skin parameters, and there are only 4 component parameter variables, which cannot fully reflect the actual skin. Insufficient accuracy of results for quantitative analysis
②It only reflects the 400-600nm wavelength range of visible light, and the wavelength range above 600nm cannot be fitted
(Because the Kubelka-Munk model does not consider horizontal scattering, the result will be higher than the real result; the Multipole model cannot be simulated in some cases of too thin skin layer due to its assumed discrete point light source position, which often occurs at 590 -700nm wavelength range; the Monte-Carlo model results are uncertain, difficult to optimize, and the required calculation time is very long) ③ Only skin-related absorption-related skin composition parameters, scattering-related skin composition parameters

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A modeling method of human skin spectrum and a mathematical modeling method of multiple skin parameters with high degree of fitting
  • A modeling method of human skin spectrum and a mathematical modeling method of multiple skin parameters with high degree of fitting
  • A modeling method of human skin spectrum and a mathematical modeling method of multiple skin parameters with high degree of fitting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Based on the needs of the application of the theoretical equation of radiation conduction, the present invention constructs a four-layer structure (skin surface, epidermal layer, dermis layer, subcutaneous tissue) model of the skin under the action of visible light (400-700nm, the maximum depth of acting on human skin is 4mm) , Abstracts the radiation conduction path analysis of the four modes of light (reflection, transmission, absorption, and scattering) on ​​the skin four-layer structure model. An optical analysis model between skin spectrum and reflection, absorption, scattering, and transmission is integrated. This model has two characteristics: 1. In the skin structure model, the epidermis and dermis thickness of the skin are used as structural variables, highlighting the influence of these two variables on the spectrum; 2. The model covers the light and skin The four action forms are complete optical models.

[0052] In the prior art, the Radiative Transfer Equatio...

Embodiment 2

[0092] On the basis of the above-mentioned skin spectral feature model, the skin biological parameters related to light sensitivity are found, the skin parameter set corresponding to the skin structure model is formed, and the correlation between skin parameters, skin structure, and light action form is established. Furthermore, by modeling the three light action forms and skin parameters, a set of mathematical expressions is established, and the relationship between skin parameters and optical properties is established. In the present invention, as many relevant skin biological parameters are involved as possible. To make the model data sufficient and improve the accuracy of the algorithm, that is, the mathematical modeling method of multiple skin parameters with high fit, the steps are as follows:

[0093] Step one establishes an equation representing the relationship between the reflectance in the rough surface layer of the skin and the roughness of the skin and the brightness ...

Embodiment 3

[0120] Preferably, in the method for mathematical modeling of multiple skin parameters with a high degree of fit of the present invention, it further includes step 7: comparing the skin parameters calculated in steps 1 to 4 with the actual skin parameters of the sample to calculate the degree of fit, It can be used for quantitative analysis of skin parameters to determine whether the mathematical modeling method for multiple skin parameters is accurate. The specific steps include 1. Measure the reflectance samples of each band of the target skin, and perform preprocessing to increase smoothness and reduce measurement noise; 2. Guess a set of initial skin biological parameters; 3. According to the steps, calculate the skin surface separately , The reflectance and transmittance of the epidermis and dermis; 4. Calculate the reflectance of the three-layer structure of the skin epidermis, dermis, and subcutaneous tissue according to the steps; 5. Calculate the reflectance of the four...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed are a modelling method for a human skin spectrum and a mathematical modelling method for a plurality of skin parameters with a high fitting degree. Two levels of analysis model, namely, a skin spectrum analysis model and a mathematical skin parameter model, are established, so that an association is established between a skin spectrum and a light-sensitive biological skin parameter; a virtual spectrum is simulated by means of a group of skin parameters; optimization iteration is then performed using information processing technology by means of the virtual spectrum and an actual spectrum; a group of optimal solutions can be found; a designated fitting degree standard is reached; and the purpose of biological quantitative analysis of skin is achieved.

Description

Technical field [0001] The present invention relates to computational biology, to a method of establishing an analysis model of skin spectrum and a modeling method of using the model to construct skin biological parameters, in particular to a modeling method of human skin spectrum and multiple skin parameters with high fitting degree. mathematical modeling methods. Background technique [0002] The interaction between light and matter will cause electronic transitions in the energy levels of atoms and molecules within the matter, causing the matter's absorption, reflection, and scattering of light to change in wavelength and intensity information. Spectrometers can be used to detect and process such changes. Compared with other analysis methods, spectral detection is non-destructive, highly sensitive, and highly accurate, and therefore has been widely used in the detection and identification of various materials. [0003] Biological and optical research shows that human ski...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/11G06F17/50
CPCG06F17/11G06F30/20
Inventor 陈威
Owner 陈威
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com