Location-aided chip wafer mapping method
A technology that assists chips and mapping methods. It is applied in the direction of measuring devices, instruments, and measuring electronics. It can solve the problems of increasing production costs and reducing chip yields, and achieves the effect of eliminating costs.
Active Publication Date: 2016-07-20
颍上县祥盛建设管理有限公司
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Problems solved by technology
[0006] However, marking on the chip not only needs to increase the production cost, but also these marks may affect the functional area of the chip and additionally reduce the yield of the chip
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[0034] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0035] According to the first embodiment of the present invention, a mobile station position-assisted chip wafer mapping method is provided, the method utilizes the mobile station position-assisted photoelectric chip wafer mapping, such as figure 1 As shown, it includes the following steps: use the mobile station to move the component under test to the extraction position, and record the step S11 of the position movement of the mobile platform; the extracted component under test together with the corresponding position movement of the mobile station in the measurement link Step S13 flowing in the middle; and step S15 of reconstructing the wafer map of the measurement parameters by using the str...
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The present invention discloses a location-aided chip wafer mapping method. The method comprises the following steps: moving elements to be measured to an extraction position through adoption of a mobile station, and recording the location movement amount of the mobile station; turning the extracted elements to be measured and the location movement amount of the corresponding mobile station or the coordinates calibrated through the location movement amount of the mobile station in a measurement link; and reconstituting parameter wafer mapping through adoption of structure parameters of each element to be measured, the location movement amount of the corresponding mobile station and the measurement parameters obtained in the measurement link. Different from the method for performing physical marking on a chip, the location-aided chip wafer mapping method is configured to mark the relative position or coordinates of the chip on the wafer by means of having the location movement amount with determined location relation with the chip and realize the reconstruction of the wafer mapping of the parameters of the chip after the measurement of the chip level physical parameters, without adding the cost in the process of the detection link on the hardware view.
Description
technical field [0001] The invention relates to a photoelectric chip wafer mapping method. Background technique [0002] Optoelectronic chips, especially the "edge-emitting" chips, such as laser diodes (LD), have quite some important property parameters that cannot be directly measured on the wafer. The traditional method is to cut the wafer (Wafer) into bars (Bar), or further cut into chips (Chip), and then detect its physical properties. [0003] Traditional chips are not marked to distinguish them in the manufacturing process. If the cut strips and chip disorder are randomly measured, it is naturally impossible to establish a physical attribute wafer mapping (WaferMapping) model. [0004] As optoelectronic chips, especially edge-emitting chips, have increased requirements for process inspection, especially their inherent drive to improve chip yield, the functional requirements of wafer mapping for optoelectronic chips have gradually been put on the agenda for process ins...
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Login to View More IPC IPC(8): H01L21/66G01R31/26
CPCG01R31/2601H01L22/12
Inventor 朱干军
Owner 颍上县祥盛建设管理有限公司