Flexible Encapsulation of Environmentally Sensitive Electronic Components
An electronic component, environmentally sensitive technology, applied in the direction of electrical components, electrical solid devices, circuits, etc. Problems such as damage to organic electroluminescent components
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no. 1 example
[0027] Figure 1A to Figure 1G It is a schematic diagram of the manufacturing process of the flexible environment-sensitive electronic component package according to the first embodiment of the present invention. Please refer to Figure 1A and Figure 1B Firstly, a flexible electronic component 110 is formed on a rigid substrate SUB1. In this embodiment, the rigid substrate SUB1 is, for example, a glass substrate or other substrates with good mechanical strength, and the flexible electronic component 110 includes a flexible substrate 112 and an environment-sensitive electronic component 114, wherein the environment-sensitive electronic The element 114 is disposed on the flexible substrate 112 . The material of the flexible substrate 110 includes glass, metal foil, plastic material or polymer material, such as polyimide (PI), polyimide and inorganic mixture (hybrid PI), polyethylene terephthalic acid Polyethylene terephthalate (PET), polyethersulfone (PES), polyacrylate (pol...
no. 2 example
[0039] Figure 2A and Figure 2B They are a schematic top view and a schematic cross-sectional view of the flexible environment-sensitive electronic component package according to the second embodiment of the present invention, respectively. Please refer to Figure 2A and Figure 2B The flexible environment-sensitive electronic component package 100' of this embodiment is similar to the flexible environment-sensitive electronic component package 100 of the first embodiment, the main difference between the two is that the first part 132 of the sealing structure 130' is The second portion 134 ′ of the sealing structure 130 ′ is, for example, a fluid. In this embodiment, the aforementioned fluid is, for example, a high surface tension fluid, a high viscosity fluid or a low hygroscopic fluid (such as silicone oil). In addition, the sealing structure 130' in the flexible environment-sensitive electronic device package 100' of this embodiment may further include a sidewall barri...
no. 3 example
[0041] Figure 3A and Figure 3B They are a schematic top view and a schematic cross-sectional view of the flexible environment-sensitive electronic component package according to the third embodiment of the present invention, respectively. Please refer to Figure 3A and Figure 3B , the flexible environment-sensitive electronic component package 100 ″ of this embodiment is similar to the flexible environment-sensitive electronic component package 100 ′ of the second embodiment, the main difference between the two is: the flexible environment-sensitive electronic component package 100 The sidewall barrier structure 136' in "is embedded in the first part 132 and the second part 134' of the sealing structure 130" at the same time. It should be noted that the second part 134' mentioned in this embodiment is not limited to is fluid, the second part 134' can also be non-fluid.
[0042] In addition, the encapsulation structure 130" of this embodiment can be manufactured in addit...
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