Laser cutting chip mounter

Abstract

The invention discloses a laser cutting chip mounter, comprising a machine body, a control assembly, a substrate feeding structure assembly, a substrate cutting positioning assembly, a laser cutting mechanism, at least two holders, a holder conveying mechanism, a substrate feeding and blanking translation mechanism, a high temperature membrane feeding structure assembly, a membrane mounting mechanism assembly, a high temperature membrane feeding and blanking translation mechanism, and a holder exchange mechanism. The laser cutting mechanism comprises a laser generator, an optical path structure, and a cutting structure. The holder is arranged on the holder conveying mechanism. The holder conveying mechanism can drive the holder to move back and forth on a Y-axis relative to the machine body. The laser cutting chip mounter is high in working efficiency, and can accurately adjust positions of all directions of a to-be-cut camera substrate, and is high in precision, and operates in a full automatic manner. The laser cutting chip mounter accurately positions the cutting position of a camera substrate, and the cut camera substrate is even and beautiful, and the substrate can be accurately mounted on a high temperature membrane. Chip-mounting effect is good, and adaptability is good.

Description

technical field [0001] The invention relates to the technical field of laser cutting and placement, in particular to a laser cutting placement machine. Background technique [0002] With the development of social and economic life, cameras are widely used, but in the existing technology, the technology of cutting camera substrates is very backward, and the method of manual cutting is often used to cut the camera substrates, and then the cut substrates are manually pasted on high temperature. On the diaphragm, but the method of manually cutting the camera substrate and the patch is inefficient, high in cost, and poor in economy, and due to the instability of manual operation, the cutting operation has a high error rate, and it is easy to damage the camera substrate during the cutting process. There are deviations in the physical structure and the position of the patch. [0003] Therefore, those skilled in the art have been devoting themselves to developing a high-efficiency,...

AI Technical Summary

Problems solved by technology

[0002] With the development of social and economic life, cameras are widely used, but in the existing technology, the technology of cutting camera substrates is very backward, and the method of manual cutting is often used to cut the camera substrates, and then the cut substrates are manually pasted on high temperature. On the diaphragm, but the method of manually cutting the camera substrate and the patch is inefficient, high in cost, and poor in economy, and due to the instability of manual operation, the cutting operation has a high error rate, and it is easy to damage the camera substrate during the cutting process. Deviations in the physical structure and the position of the patch

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