Tape coiling type intelligent card module SMD packaging structure and manufacturing method thereof
A chip packaging and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., to achieve the effects of thin products, good heat dissipation, and high efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0027] The specific embodiments of the tape-and-reel smart card module patch packaging structure and manufacturing method provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0028] see figure 1 , the manufacturing method of the tape-and-reel smart card module patch package structure of the present invention includes the following steps: step S10, providing a carrier tape; step S11, making a plurality of package body frames on the carrier tape, and each package body frame includes a base island and pins arranged around the base island; step S12, sticking a chip on the base island; step S13, electrically connecting the chip and the pins with a metal solder tab; step S14, encapsulating the The base island, the pins and the chips are described to form a plurality of packages on the carrier tape; step S15 , the carrier tape with the packages is wound or the carrier tape is removed to form an independent package body.
...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap