Pump assembly device for satellite-borne high heating flux heat dissipation
A technology of high heat flux density and pump assembly, which is applied to the components, pump devices, pump elements, etc. of pumping devices for elastic fluids, and achieves the effect of simple interface, compact structure and small volume of the device.
Active Publication Date: 2016-08-17
SHANGHAI SATELLITE ENG INST
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Problems solved by technology
Future deep space exploration missions include planets, moons, comets, and the sun. The thermal control requirements of scientific and engineering devices involved in these missions are very strict and challenging. The current traditional thermal control technology is obviously unable to meet the requirements.
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[0028] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0029] Fluid circuit technology is one of the active thermal control technologies to solve the heat dissipation of high heat flux onboard. It is to force the fluid medium to circulate in the set channel, so as to realize the collection of heat from the heating part and then transfer it to the cooling part for discharge. Dispersion, continuously adapt to changes in working conditions for temperature control. The fluid circuit technology exchanges heat through the flow of the fluid. The heat transfer mode...
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The invention provides a pump assembly device for satellite-borne high heating flux heat dissipation. The pump assembly device comprises a device structure member provided with a working medium inlet, a working medium outlet, a liquid charging opening and an inflation opening; two driving pumps are arranged on a bottom plate of the device structure member, and inlets of the two driving pumps communicate with the working medium inlet through a connecting pipeline; two one-way valves are arranged on the bottom plate of the device structure member, and inlets of the two one-way valves communicated with outlets of the two driving pumps through a connecting pipeline; outlets of the two one-way valves communicate with the working medium outlet through a connecting pipeline; a liquid storage device is arranged on the bottom plate of the device structure member; an inflation valve and a liquid charging valve are arranged on a side plate of the device structure member; an inlet of the liquid charging valve communicates with the liquid charging opening, and an inlet of the inflation valve communicates with the inflation opening. The pump assembly device has the beneficial effects that 1, the structure is compact, the size is small, the weight is low, and the resource occupation is small during application; 2, the whole device is simple in connector and convenient to mount; 3, material sources are sufficient, and the process is simple and easy to achieve.
Description
technical field [0001] The invention relates to a pump assembly device, in particular to a drive pump assembly device used for heat dissipation with high heat flux on board. Background technique [0002] With the increasing heat dissipation requirements of high-energy electronic components, the need for more efficient cooling systems is becoming more and more important in the face of future space missions and applications. Future deep space exploration missions include planets, moons, comets, and the sun. The thermal control requirements of scientific and engineering devices involved in these missions are very strict and challenging, and the current traditional thermal control technology is obviously unable to meet them. In order to meet the latest aerospace exploration missions, and based on the goal of "faster, better, and more economical", designers have to consider developing advanced thermal control technologies to meet mission requirements. Contents of the invention ...
Claims
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IPC IPC(8): F04D13/14F04D13/16F04D15/00F04D29/42
CPCF04D13/14F04D13/16F04D15/0005F04D29/426
Inventor 曾凡健顾燕萍
Owner SHANGHAI SATELLITE ENG INST