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Reflow soldering method of surface mount device type LED lamp reducing damage rate

A technology of reflow soldering and chip components, which is applied in the direction of welding equipment, printed circuits, electrical components, etc., can solve the problems of workpiece damage, uneven temperature, energy waste, etc., and achieve effective welding, rapid cooling temperature reduction, and accelerated cooling efficiency Effect

Inactive Publication Date: 2016-09-07
周杰
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  • Claims
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Problems solved by technology

[0010] The technical problem to be solved by the present invention is: to provide a reflow soldering method for SMD LED lamps, which solves the problem of uneven temperature caused by continuous heating in the reflow soldering process in the prior art, and the high temperature in the reflow soldering area is easy to cause damage to the workpiece. The problem of wasting energy

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  • Reflow soldering method of surface mount device type LED lamp reducing damage rate

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Embodiment Construction

[0030] The working process of the present invention will be further described below in conjunction with the accompanying drawings.

[0031] Such as figure 1 As shown, a method for reflow soldering of chip components comprises the following steps:

[0032] Step 1. The temperature of the preheating zone is raised, and the temperature of the preheating zone is controlled to increase at a slope less than or equal to 4°C / s, and the temperature increases to 150°C to 200°C;

[0033] Step 2. Wet the solder paste in the constant temperature zone, and keep the temperature between 150°C and 200°C for 60 to 100 seconds until the solder paste is completely melted;

[0034] Step 3. Reflow soldering in the reflow area, control the temperature to rise to the peak temperature within 25-30 seconds, and keep the peak temperature ±5°C for no more than 10 seconds;

[0035] Step 4, cooling in the cooling zone, controlling the temperature to decrease at a slope of 6°C / s or less until the temperatu...

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Abstract

The invention discloses a reflow soldering method of a surface mount device type LED lamp reducing the damage rate. The method comprises the following steps: stopping heating when the temperature is raised to 80-90 DEG C in a raising process of a preheating region, maintaining the temperature for 8-10s, and then continuously raising the temperature to 150-200 DEG C at a slope of 4 DEG C / s; controlling the temperature raise of the temperature of the preheating region at the slope smaller than or equal to 4 DEG C / s to 150-200 DEG C, wherein a workpiece is fully preheated at the temperature, the heat impact in a heating process is slowed down, and residual heat is effectively utilized, so that the preheating efficiency is improved and meanwhile, the energy source is saved; and after maintaining the peak temperature + / -5 DEG C for not longer than 10s in a reflow soldering process in a reflow soldering region, reducing the temperature to be 25-35 DEG C lower than the peak temperature and maintaining the temperature for 10-20s, wherein the damage of the workpiece due to long-time continuous high temperature is avoided, and meanwhile, the workpiece is effectively soldered.

Description

technical field [0001] The invention belongs to the field of LED applications, and in particular relates to a reflow soldering method for chip components. Background technique [0002] General technical requirements and main forms of reflow soldering temperature curve: [0003] General technical requirements for each link of the reflow soldering temperature curve: Generally speaking, the reflow soldering temperature curve can be divided into three stages: preheating stage, reflow stage, and cooling stage. [0004] ① Preheating stage: Preheating refers to the heating behavior for the purpose of activating the tin water and avoiding the rapid high temperature heating during immersion tin, which will cause the parts to fail. Preheating temperature: set according to the type of solder paste used and the conditions recommended by the manufacturer. Generally, it is set in the range of 80-160°C to make it warm up slowly (the best curve); while for the constant temperature zone of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/20
CPCB23K1/0008B23K1/0016B23K1/20B23K2101/42H05K3/3468H05K3/3494H05K2201/10106H05K2203/043
Inventor 不公告发明人
Owner 周杰
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