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Ceramic electronic component and method of manufacturing the same

A technology of electronic components and ceramics, which is applied in the field of ceramic electronic components and its manufacturing, and can solve the problems of reduced reliability of electronic components

Active Publication Date: 2016-09-07
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the plating solution permeates into the electronic components, or hydrogen gas is generated when the plating is performed, so the reliability of the electronic components decreases

Method used

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  • Ceramic electronic component and method of manufacturing the same
  • Ceramic electronic component and method of manufacturing the same
  • Ceramic electronic component and method of manufacturing the same

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Embodiment Construction

[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0029] However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0030] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0031] figure 1 is a perspective view of a ceramic electronic assembly according to an exemplary embodiment. figure 2 is along figure 1 The cross-sectional view taken along the I-I' line. image 3 was obtained by scanning electron microscopy (SEM) figure 2 A photograph of area A.

[0032] refer to Figure 1 to Figure 3 , The ceramic...

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PUM

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Abstract

A ceramic electronic component and a method of manufacturing the same are provided. The ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2015-0027191 filed in the Korean Intellectual Property Office on February 26, 2015, the entire contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates to an electronic component, and more particularly, to a ceramic electronic component formed of a ceramic material and a manufacturing method thereof. Background technique [0003] In general, electronic components using ceramic materials, such as capacitors, inductors, piezoelectric elements, varistors, and thermistors, include a ceramic body formed of ceramic materials, internal electrodes formed in the ceramic body, and surface to connect the outer electrodes to the inner electrodes. [0004] Among ceramic electronic components, a multilayer ceramic capacitor includes a plurality of stacked dielectric layers, a plurality of internal electrodes disposed to face each other with th...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/12H01G4/232
CPCH01G4/12H01G4/232H01G4/30H01G4/2325
Inventor 李京鲁李圭夏庾胜熙崔恩柱金俊亨全炳俊
Owner SAMSUNG ELECTRO MECHANICS CO LTD