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Spiral fractal based integrated micro flat plate heat pipe

A flat heat pipe, micro-miniature technology, applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating modification, electrical components, etc., can solve the problem of increasing the contact thermal resistance of the radiator, and achieve the elimination of contact thermal resistance and enhance Heat exchange effect, effect of improving heat dissipation efficiency

Active Publication Date: 2016-09-21
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The traditional micro-flat heat pipe manufacturing process is to design and manufacture the heat sink and the micro-flat heat pipe separately, and then apply thermal silica gel on the contact surface before attaching the micro-flat heat pipe to the bottom surface of the heat dissipation fin. The design is easy to process and manufacture, but such a design will undoubtedly increase the contact thermal resistance of the heat sink

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  • Spiral fractal based integrated micro flat plate heat pipe
  • Spiral fractal based integrated micro flat plate heat pipe
  • Spiral fractal based integrated micro flat plate heat pipe

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Embodiment Construction

[0035] The present invention will be further described in conjunction with accompanying drawing:

[0036] figure 1 A schematic plan view of the overall structure of an integrated micro-miniature flat heat pipe based on spiral fractal of the present invention is given, figure 2 It is a three-dimensional schematic diagram of the overall structure of an integrated micro-miniature flat heat pipe based on spiral fractal in the present invention. In the figure, an integrated micro-miniature flat heat pipe adopting the arrangement of Fibonacci spiral fractal channels is composed of a gas-liquid phase change cavity and cooling fins. The gas-liquid phase change cavity is composed of a heat-conducting substrate 1 , a channel 3 , a porous metal material 2 , a liquid filling port 7 , a cooling fin cavity 8 and a liquid-absorbing core 4 . A slot 3 with a Fibonacci spiral fractal is arranged in the heat-conducting substrate 1 (such as image 3 shown), the porous metal material 2 is atta...

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Abstract

The invention discloses a spiral fractal based integrated micro flat plate heat pipe. The spiral fractal based integrated micro flat plate heat pipe comprises a heat conduction substrate and radiating fins, wherein a liquid injecting opening is formed in the heat conduction substrate; the integrated micro flat plate heat pipe is characterized in that a Fibonacci spiral fractal-shaped channel is formed in the heat conduction substrate; the liquid injecting opening is connected with the channel; the radiating fins are arranged in the channel; the radiating fins are heat conduction fins with radiating fin cavities; the radiating fin cavities are connected with the channel; and liquid-absorbing cores are arranged on the inner wall surfaces of the radiating fin cavities. According to the flat plate heat pipe, the heat exchange level and the thermal homogeneity of the micro flat plate heat pipe are greatly improved; and an effective approach for solving the problem of partial high heat flow of electronic components is provided.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a spiral fractal-based integrated miniature flat heat pipe designed to improve heat exchange performance. Background technique [0002] In recent years, with the rapid development of aerospace technology, information engineering, energy chemical industry, microelectronics technology, etc., the degree of integration of electronic circuits has been continuously improved, and the capacity of electronic components has been continuously expanded, and the resulting high heat flux density of electronic components become a major hidden danger affecting its normal work. The traditional heat dissipation method of simply using air forced convection cooling has reached the limit of heat transfer, and the heat dissipation problem has become the main bottleneck restricting the development of high heat flux optoelectronic chip technology and industry. [0003] Heat pipe heat dissipation technology ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/2039
Inventor 张程宾陈功万意辛佳磊张孟臣
Owner SOUTHEAST UNIV