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Preparation method of anisotropic conductive adhesive film

An anisotropic conductive adhesive and conductive liquid technology, which is applied in the direction of conductive adhesives, film/sheet adhesives, adhesives, etc., can solve the problem that it is difficult to maintain the conduction resistance of electrodes, the distribution of conductive particles cannot be controlled, Material conductivity limitations and other issues

Active Publication Date: 2019-03-12
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

However, the distribution of conductive particles in the anisotropic conductive adhesive film produced by this method cannot be controlled. In the binding structure formed by the anisotropic conductive adhesive film prepared by this traditional preparation process, the It is difficult to maintain the same on-resistance between them, and there is a risk that some electrodes are not in contact with the conductive particles, resulting in an open circuit. Therefore, the conductivity of the material is limited

Method used

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  • Preparation method of anisotropic conductive adhesive film
  • Preparation method of anisotropic conductive adhesive film
  • Preparation method of anisotropic conductive adhesive film

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Embodiment Construction

[0033] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0034] see figure 1 , the invention provides a kind of preparation method of anisotropic conductive adhesive film, comprising the following steps:

[0035] Step 1, such as Figure 2-3 As shown, a hard plate 100 and a base film material 210 are provided, and the base film material 210 is fixed on the hard plate 100 .

[0036] Wherein, the fixation of the base film material 210 on the hard plate 100 can be carried out by using the existing flexible film fixation method in the field, because it is a prior art, so it will not be repeated here.

[0037] Specifically, the hard plate 100 provided in step 1 is a glass plate.

[0038] Specifically, the base film material 210 provided in step 1 is a polyimide film.

[0039] Step 2, such as Figure ...

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Abstract

The invention provides a method for preparing differential conductive adhesive films. The method includes regularly forming a plurality of holes in resin adhesive films; adding conductive liquid with conductive particles into the holes in the resin adhesive films drop by drop by means of spraying to obtain differential conductive adhesive layers. The holes are perforated through the resin adhesive films. The method has the advantages that arrangement modes for the holes in the resin adhesive films can be specially designed according to particular application scenes for the differential conductive adhesive films, accordingly, distribution conditions of the conductive particle in the differential conductive adhesive films can be accurately controlled, and the method is particularly applicable to differential conductive adhesive film materials with high-precision requirements.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a preparation method of an anisotropic conductive adhesive film. Background technique [0002] With the development of electronic technology, people's daily life and work are increasingly inseparable from electronic products. As an important component of electronic products, liquid crystal displays also closely affect people's experience in use. [0003] Anisotropic Conductive Film (ACF) is a translucent polymer continuous material with three characteristics of adhesion, conductivity and insulation at the same time. It mainly includes resin glue and conductive particles mixed in the resin glue. It has the characteristics of conduction in the vertical direction and insulation in the horizontal direction. Up to now, the application of ACF has a history of more than 60 years. With the market requirements and development trends of lighter, thinner, shorter and smaller bonding struc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25C09J9/02C09J163/00C09J133/00C09J11/04
CPCC08K3/08C08K7/06C08K7/24C08K9/10C08K2201/011C09J7/25C09J9/02C09J11/04C09J133/00C09J163/00C09J2301/18C09J2301/314
Inventor 李兰艳
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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