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Method used for leveling verification test and method for calibrating lithographic projection equipment

A technology for verification testing and lithography equipment, which is applied in the semiconductor field, can solve the problems of low reliability, time-consuming exposure, and falsehood, so as to achieve accurate monitoring results, save monitoring time, and avoid adverse effects

Active Publication Date: 2016-10-05
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, a spurious association with defocus is established, which tends to discredit existing LVT results
In addition, two exposures consume more time

Method used

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  • Method used for leveling verification test and method for calibrating lithographic projection equipment
  • Method used for leveling verification test and method for calibrating lithographic projection equipment
  • Method used for leveling verification test and method for calibrating lithographic projection equipment

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Embodiment Construction

[0019] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0020] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0021] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the / the" are intended to include...

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Abstract

The invention provides a method used for a leveling verification test and a method for calibrating lithographic projection equipment. The method used for the leveling verification test comprises the following steps: processing lens in lithographic equipment for performing single exposure on a first pattern and a second pattern on a photomask, performing inner and outer nesting on a first labeling figure and a second labeling figure formed on a wafer; measuring the alignment offset of the first labeling figure and the second labeling figure, and transferring the alignment offset to defocus data. The provided method used for the leveling verification test improves a technology that an inner and outer nested label group is formed by two times exposure to the technology with one time exposure by achieving the same purpose, unfavorable influence due to possible machinery movement between two times exposure can be avoided, monitoring result is more accurate, and the monitoring time is saved.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to a method for leveling verification test (Leveling Verification Test, LVT). Background technique [0002] LVT is employed today to verify the quality of focus control in lithography tools. Specifically, LVT uses a special reticle with a glued glass wedge on top to locally produce non-telecentric illumination on a bi-telecentric lens. Using this non-telecentric illumination induces a lateral shift in the x,y directions as a function of the defocus Z of the virtual image of the XPA alignment mark under the glass wedge. By measuring the alignment shift of this defocus mark relative to the XPA fiducial mark (imaged without the top wedge), the defocus at the instant of exposure can be determined. [0003] However, existing LVT processes typically require two exposures, which can cause problems. For example, mechanical (eg, wafer stage, etc.) movements may be involved ...

Claims

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Application Information

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IPC IPC(8): G03F7/20G03F9/00
Inventor 刘洋胡华勇邓国贵
Owner SEMICON MFG INT (SHANGHAI) CORP