Supercharge Your Innovation With Domain-Expert AI Agents!

Semiconductor device

A semiconductor and housing technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of high cost and increased manufacturing cost, and achieve the effect of suppressing increase and suppressing welding parts.

Active Publication Date: 2016-10-05
株式会社PANGEA
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cost of soldering such as SMT is high, if the number of soldered parts increases, the manufacturing cost will increase accordingly.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0026] figure 1 It is a diagram showing a configuration example of a plug-integrated semiconductor device capable of data transfer using USB 3.0 by connecting to a socket. In addition, if it is a standard using the same signal, it can also be used as a semiconductor device that can perform data transfer using other USB standards. figure 1 The illustrated semiconductor device 1 includes a case 11 , a circuit board 12 having four external connection terminals 125 , and five external connection terminals 13 provided in the case 11 . figure 1 In , for the sake of convenience, a part of the housing 11 is indicated by a dotted line, and the boundary between the solid line and the dotted line is indicated by a wavy line.

[0027] As the external connection terminal 125, a power supply terminal (VBUS), a signal terminal (D+, D-) for normal transmission of a data signal as a differential signal, and a ground terminal (GND), etc. are provided using USB2.0 or USB3.0 An external connect...

no. 2 Embodiment approach

[0058] Figure 8 and Figure 9 It is a diagram showing a configuration example of a plug-type semiconductor device capable of performing data transfer by USB by connecting to a socket. Figure 8 is a schematic diagram viewed from the side direction, Figure 9 is a schematic view viewed from the upper surface direction. in addition, Figure 8 and Figure 9 In the figure, some components are not shown for the sake of convenience.

[0059] Figure 8 and Figure 9 The illustrated semiconductor device 2 includes a case 21 , a circuit board 22 , and a plug 23 . In addition, as the description of the case 21 and the circuit substrate 22, the figure 2 A description of the housing 11 and circuit substrate 12 is shown.

[0060] The housing 21 has an opening 210 . The inner wall of the opening 210 has an insertion hole 24a and a groove 24b. Although the planar shape of the insertion hole 24a and the groove part 24b is rectangular, it is not limited to this. In addition, the ...

no. 3 Embodiment approach

[0072] Figure 12 It is a diagram showing a structural example of a semiconductor device capable of data transfer using USB3.0 by connecting to a socket. In addition, if it is a standard using the same signal, it can also be used as a semiconductor device that can perform data transfer using other USB standards. Figure 12 The illustrated semiconductor device 3 includes a case 31 , a circuit board 32 , and external connection terminals 33 . In addition, as a description of the case 31, the circuit board 32, and the external connection terminal 33, it is possible to refer to figure 2 Description of the case 11, the circuit substrate 12, and the external connection terminals 13 shown.

[0073] The housing 31 has an opening 310 . A convex portion 311 is provided on an inner wall of the opening portion 310 . The housing 31 is formed of, for example, a material that can be applied to the housing 11 . For example, the housing 31 having the opening 310 may be formed by bonding ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present invention is provided to inhibit an increase of soldering portion. The embodied semiconductor device is capable of using USB to perform data transmission through connection to a socket, and includes a housing, a circuit substrate, and second external connection terminals. The housing is provided with an opening portion. The circuit substrate is inserted into the opening portion and includes: a wiring substrate including a plurality of connection pads having first external connection terminals capable of connecting to the socket; and a semiconductor chip disposed on the wiring substrate. The second external connection terminal includes: a fixed portion fixedly connected to an inner wall of the opening portion; a socket connection portion arranged on the same surface as the fixed portion for connection to the socket; and a first pad connection portion and a second pad connection portion that are arranged on the opposite surfaces relative to the fixed portion and electrically connected to at least one of the plurality of connection pads.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2014-188532 (filing date: September 17, 2014). This application incorporates all the contents of the basic application by referring to this basic application. technical field [0003] The invention of the embodiment relates to a semiconductor device. Background technique [0004] USB (Universal Serial Bus: Universal Serial Bus) is known as one of the connection standards for connecting information equipment such as a computer to peripheral equipment. For example, by using a USB connector including a male connector (also called a plug) and a female connector (also called a receptacle) to connect an information device and a peripheral device, not only data can be transferred, for example, information about the peripheral device can also be obtained from the information device. power supply necessary for operation, or connect multiple d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L23/48
CPCH01L2224/48091H01L2224/49175H01L2924/181H01L2924/00012H01L2924/00014
Inventor 佐藤宏贵向田秀子藤巻明子筑山慧至尾山胜彦小坂善幸渡辺章雄原嶋志郎安达浩祐松浦永悟山口量平土肥雅之
Owner 株式会社PANGEA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com