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A packaging device and packaging method

A packaging device and a technology for packaging components, which are applied in the manufacture of electrical components, electric solid devices, semiconductor/solid devices, etc., can solve the problems of prolonging the life of organic light-emitting components, low packaging pass rate, and difficult operation, etc. The effect of lowering the cost of the unit, improving the qualified rate of packaging, and improving the success rate of sintering

Active Publication Date: 2018-06-29
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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AI Technical Summary

Problems solved by technology

This packaging technology uses a laser or other radiation source to directly heat the glass frit coated between two substrates, melts the glass frit, and then solidifies it to seal the two substrates tightly. At the same time, this localized heating method protects other parts from Damage, so that the components located in the confined space formed by the two substrates and the glass frit are isolated from the outside world, effectively prolonging the life of the organic light-emitting component. This technology has the advantages of local heating, small heating area, fast speed and high efficiency, but Laser sintering of glass frit is difficult and prone to failure, resulting in low packaging pass rate

Method used

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  • A packaging device and packaging method
  • A packaging device and packaging method
  • A packaging device and packaging method

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Embodiment Construction

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

[0044] Although the encapsulation device of the present invention is described below as an example of encapsulating organic light-emitting elements, it should be understood that the encapsulation device of the present invention can also be used in other same or similar encapsulation or sealing technologies to seal elements or devices in glass or substrate. In the present invention, "upper / upper", "lower / lower", "horizontal", ...

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Abstract

The present invention provides a packaging device, which is used to package components to be packaged, comprising: a radiation source; a carrying platform, used to carry the components to be packaged; A component selectively shields the beam of the radiation source; and a control module, when the beam moving speed of the radiation source does not change more than ±10% within T time, it reaches a steady state, and after the beam energy reaches a steady state, it is used for The shielding member is controlled to allow the light beam of the radiation source to radiate onto the component to be packaged, and the T time is the time for completing one sintering. The present invention also provides a packaging method using the above packaging device. By using the shield and the control module, the moving speed of the laser or the carrier and the laser energy can be in a stable state during the sintering process, effectively improving the success rate of sintering.

Description

technical field [0001] The present invention relates to a packaging device and a packaging method, in particular to a device and method for packaging a component to be packaged (such as an organic light-emitting panel) using a radiation source such as a laser or an infrared emitter. Background technique [0002] Organic light-emitting diodes (OLEDs), which have the advantages of high brightness, low driving voltage, fast response, and multi-color performance, have been gradually applied to flat-panel displays. However, the elements of OLEDs are susceptible to the infiltration of moisture and oxygen in the surrounding environment, which will lead to oxidation of electrode materials, reduction of luminous efficiency or color changes, and ultimately shorten the service life of the LEDs. Therefore, in the manufacture of organic light emitting diodes, the encapsulation process is particularly important to completely isolate the organic light emitting diodes from moisture and oxyg...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52
Inventor 王演隆王玉清翟宏峰尚卫
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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