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Component Mounting System

A technology for installing systems and components, applied in the direction of electrical components, electrical components, etc., can solve problems such as inability to install components

Active Publication Date: 2019-01-08
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the component mounting system of the aforementioned Japanese Patent No. 4762480 is not configured to mount components on a plurality of substrates with different mounting surfaces.
Therefore, there is a problem that components cannot be efficiently mounted on various substrates with different mounting surfaces.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0037] refer to figure 1 , the configuration of the component mounting system 100 according to the first embodiment of the present invention will be described.

[0038] The component mounting system 100 of the first embodiment is configured by mounting components on a substrate 10 and manufacturing a substrate on which the components are mounted. Such as figure 1 As shown, the component mounting system 100 includes a main machine 1 , a loader 2 , a printing machine 3 , a distribution conveyor 4 , a component mounting device 5 , a reflow oven 6 and an unloader 7 . The loader 2 , the printer 3 , and the unloader 7 are provided for each type of substrate 10 . Multiple distribution conveyors 4 (4a, 4b, 4c, 4d, 4e, 4f) are installed. A plurality of component mounting devices 5 ( 5 a , 5 b , 5 c , 5 d ) are installed between the printer 3 and the reflow furnace 6 along the substrate production line.

[0039] In addition, in the component mounting system 100 , the substrate 100 i...

no. 2 approach

[0091] Next, refer to Figure 6 ~ Figure 15 , the component mounting system 200 according to the second embodiment of the present invention will be described. In this second embodiment, an example in which four lanes are provided in the component mounting device 105 will be described differently from the first embodiment in which two lanes (mounting lane 52a and conveyance lane 52b) are provided in the component mounting device 5 . In addition, the same code|symbol is used about the same structure as the said 1st Embodiment, and the description is abbreviate|omitted.

[0092] Such as Figure 6 As shown, the component mounting system 200 of the second embodiment includes a main machine 101 , a distribution conveyor 104 , and a component mounting device 105 .

[0093]The distribution conveyor 104 is provided in plurality (104a, 104b, 104c, 104d, 104e, 104f). Specifically, six distribution conveyors 104 are provided: the distribution conveyor 104a between the printing press 3 ...

no. 3 approach

[0126] refer to Figure 16 ~ Figure 17 , the configuration of the component mounting system 300 according to the third embodiment of the present invention will be described. In this third embodiment, unlike the above-mentioned first embodiment in which the same number (one) of component mounting devices 5 ( 5 a to 5 d ) are installed between the respective distribution conveyors 4 , the installation between the distribution conveyors 4 will be described. Examples of different numbers of component mounting devices 205 . In addition, the same code|symbol is used about the same structure as the said 1st Embodiment, and the description is abbreviate|omitted.

[0127] Such as Figure 16 As shown, the component mounting system 300 of the third embodiment includes a host machine 201 and a component mounting device 205 .

[0128] A plurality of component mounting devices 205 of the third embodiment are provided. Specifically, six component mounting devices 205 are provided: the co...

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PUM

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Abstract

The invention provides a component mounting system including a plurality of mounting devices and a plurality of distribution conveyors. A distribution conveyor performing lane changeover operation is based on the mounting load of a board of a first type and the mounting load of a board of a second type. The lane changeover operation includes distributing one of the board of the first type and the board of the second type from the mounting lane to a transfer lane and distributing the other of the board of the first type and the board of the second type from the transfer lane to mounting lane.

Description

technical field [0001] The present invention relates to a component mounting system, and more particularly to a component mounting system provided with a plurality of component mounting devices. Background technique [0002] Conventionally, a component mounting system including a plurality of component mounting devices is known. Such a component mounting system is disclosed in Japanese Patent No. 4762480, for example. [0003] In the aforementioned Japanese Patent No. 4762480, a component mounting system is disclosed, which includes a mounting device group A composed of a plurality of component mounting devices and a mounting device group composed of a plurality of component mounting devices and arranged downstream of the mounting group A. b. In this component mounting system, the mounting group A and the mounting group B are respectively provided with a mounting path for conveying substrates undergoing mounting operations and a bypass path (transportation path) for convey...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 中村亮介
Owner YAMAHA MOTOR CO LTD