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A high-refractive-index, high-toughness, vulcanization-resistant LED encapsulation silicone

A technology of LED packaging and high refractive index, applied in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of easy cracking of packaging materials, impact dead lights, and reduced material toughness, and achieve vulcanization resistance. The effect of increasing and decreasing internal stress and increasing cross-linking density

Active Publication Date: 2019-03-29
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the formula design, methods such as increasing the content of phenyl silicone resin and increasing the crosslinking density are used to improve the vulcanization resistance. Although such a design improves the vulcanization resistance, the internal stress of the packaging material is too high, which will lead to a decrease in the toughness of the material. The reaction is in After encapsulation, high and low temperature cold and heat impact dead lights, and the encapsulation material is easy to crack after high and low temperature.

Method used

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  • A high-refractive-index, high-toughness, vulcanization-resistant LED encapsulation silicone
  • A high-refractive-index, high-toughness, vulcanization-resistant LED encapsulation silicone
  • A high-refractive-index, high-toughness, vulcanization-resistant LED encapsulation silicone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation of component A: Weigh 80 parts of methyl phenyl vinyl silicone resin, 14.9 parts of vinyl methyl phenyl polysiloxane, 0.1 part of platinum-based catalyst, and 5 parts of adhesive. , that is, the A component is obtained;

[0039] Preparation of component B: Weigh 19.7 parts of methylphenyl vinyl silicone resin, 70 parts of methylphenyl hydrogen-containing silicone resin, 10 parts of hydrogen-containing toughening crosslinking agent, and 0.3 part of inhibitor. Add in the mixer one by one, mix and stir evenly to obtain the B component;

[0040] When using, mix the A component and the B component evenly according to the weight ratio of 5:1, vacuum defoaming for 20 minutes, dispense or pour glue on the to-be-packaged part, and first heat it at 80°C for 1 hour , and then heated at 150 ° C for 4 hours.

Embodiment 2

[0042] Preparation of component A: Weigh 88.7 parts of methyl phenyl vinyl silicone resin, 10 parts of vinyl methyl phenyl polysiloxane, 0.3 part of platinum-based catalyst, and 1 part of adhesive, and then add them into the mixer and mix them evenly , that is, the A component is obtained;

[0043] Preparation of component B: Weigh 19.9 parts of methylphenyl vinyl silicone resin, 80 parts of methylphenyl hydrogen-containing silicone resin, 1 part of hydrogen-containing toughening crosslinking agent, and 0.1 part of inhibitor. Add in the mixer one by one, mix and stir evenly to obtain the B component;

[0044] When using, mix the A component and B component evenly according to the weight ratio of 5:1, vacuum defoaming for 20 minutes, dispense or pour glue on the to-be-packaged part, and first heat it at 100 ° C for 1 hour , and then heated at 160 ° C for 4 hours.

Embodiment 3

[0046] Preparation of component A: Weigh 85 parts of methyl phenyl vinyl silicone resin, 12.3 parts of vinyl methyl phenyl polysiloxane, 0.2 part of platinum-based catalyst, and 2.5 parts of adhesive. , that is, the A component is obtained;

[0047] Preparation of component B: Weigh 19.3 parts of methylphenyl vinyl silicone resin, 75 parts of methylphenyl hydrogen-containing silicone resin, 5.5 parts of hydrogen-containing toughening crosslinking agent, and 0.2 part of inhibitor. Add in the mixer one by one, mix and stir evenly to obtain the B component;

[0048] When using, mix the A component and the B component evenly according to the weight ratio of 5:1, vacuum defoaming for 20 minutes, dispense or pour glue on the to-be-packaged part, and first heat it at 120 ° C for 1 hour , and then heated at 150 ° C for 4 hours.

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Abstract

The invention relates to the technical field of adhesives, in particular to high-refractive-index high-toughness vulcanization-resistant LED packaging silica gel. The silica gel is prepared from a component A and a component B, and the weight ratio of the component A to the component B is 5:1, wherein the component A is prepared from, by weight, 80-90 parts of methyl phenyl vinyl silicone resin, 10-20 parts of vinyl methyl phenyl polysiloxane, 1-5 parts of adhesive and 0.1-0.3 part of platinum-based catalyst, and the component B is prepared from, by weight, 10-20 parts of methyl phenyl vinyl silicone resin, 70-80 parts of methyl phenyl hydrogen-containing silicon resin, 1-10 parts of hydrogen-containing toughening cross-linking agent and 0.1-0.3 part of inhibitor. Internal stress of the silica gel material after being cured is reduced, and cold and heat impact resistance and high temperature resistance of products are improved.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-refractive index, high-toughness, and vulcanization-resistant LED packaging silica gel. Background technique [0002] As LED applications become more and more extensive, the requirements for LED packaging materials are also getting higher and higher. The packaging materials currently used for LEDs mainly include epoxy resin and silicone materials. Epoxy resin has large internal stress, high light decay, no yellowing resistance, and poor aging resistance. For silicone materials, corresponding to epoxy resin, the internal stress Small, non-yellowing, low light decay, and the overall performance is significantly better than epoxy resin, so it quickly replaces epoxy resin and is widely used in the field of LED packaging. In particular, LED packaging silica gel with a refractive index higher than 1.50 is increasingly used due to its higher light extraction efficiency. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/06
CPCC08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/06C09J183/04C08L83/04C08K5/5435C08K5/5477C08K5/05
Inventor 庄恒冬陈维
Owner YANTAI DARBOND TECH
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