Release film for printed circuit board production, method for producing release film for printed circuit board production, method for producing printed circuit board, and printed circuit board

A technology for a printed circuit substrate and a manufacturing method, which is applied in the field of release films for the manufacture of printed circuit substrates, can solve the problems of unevenness, local thickness of pinholes easily generated in the printed circuit substrate, etc. The effect of preventing breakage

Active Publication Date: 2018-06-01
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if a thin printed circuit board is manufactured using the conventional release film, problems such as pinholes and local thickness unevenness tend to occur on the surface of the printed circuit board.

Method used

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  • Release film for printed circuit board production, method for producing release film for printed circuit board production, method for producing printed circuit board, and printed circuit board
  • Release film for printed circuit board production, method for producing release film for printed circuit board production, method for producing printed circuit board, and printed circuit board
  • Release film for printed circuit board production, method for producing release film for printed circuit board production, method for producing printed circuit board, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0219] First, prepare a biaxially oriented polyethylene terephthalate film [thickness: 31 mm, arithmetic average roughness Ra of the first surface] as a base material 2 : 23nm, the maximum protrusion height Rp of the first surface 2 : 415nm, the arithmetic mean roughness Ra of the second surface 3 : 23nm, the maximum protrusion height Rp of the second surface 3 : 415nm].

[0220] Then, 100 parts by mass of melamine resin [manufactured by Mitsui Cytec Co., Ltd., trade name "Symel 303", hexamethoxymethylmelamine, mass average molecular weight 390, solid content 100 mass %], and 5 p-toluenesulfonic acid as an acidic catalyst Parts by mass and a mixed solvent (mass ratio 4 / 1) of isopropanol and isobutanol were mixed to obtain a composition for forming a smoothing layer with a solid content of 15% by mass.

[0221] Then, the obtained composition for smoothing layer formation was apply|coated on the 1st surface 111 of the base material 11 with the bar coater, and the 1st coating ...

Embodiment 2

[0225] Except having used the composition for smoothing layer formation obtained as follows, and the composition for release agent layer formation, it carried out similarly to Example 1, and manufactured the release film for printed circuit board manufacture.

[0226] Melamine resin [manufactured by Mitsui Cytec Corporation, trade name "Symer 303", hexamethoxymethylmelamine, mass average molecular weight 390, solid content 100% by mass] 65 parts by mass, and a diol compound [2- Methyl-1,3-propanediol, manufactured by Tokyo Chemical Industry Co., Ltd., mass average molecular weight 90, solid content 100%] In a mixture of 30 parts by mass, 5 parts by mass of p-toluenesulfonic acid as an acidic catalyst, and isopropanol and isopropanol A mixed solvent of butanol (mass ratio 4 / 1) was used to obtain a composition for forming a smoothing layer with a solid content of 15% by mass.

[0227] In addition, 65 parts by mass of melamine resin [manufactured by Mitsui Cytec Co., Ltd., trade ...

Embodiment 3

[0229] Except using biaxially oriented polyethylene terephthalate film [thickness: 31mm, arithmetic mean roughness Ra of the 1st side 2 : 19nm, the maximum protrusion height Rp of the first surface 2 : 216nm, the arithmetic mean roughness Ra of the second surface 3 : 19nm, the maximum protrusion height Rp of the second surface 3 : 216 nm], except that it was used as a base material, it carried out similarly to Example 1, and produced the release film for printed circuit board manufacture.

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Abstract

The peeling film for manufacturing printed circuit boards of the present invention is characterized in that it has a substrate (11), a smoothing layer (12) and a release agent layer (13), and the smoothing layer (12) contains a mass average molecular weight of 950 or less by heating. The composition for forming a smoothing layer containing a melamine resin as a main component is formed by curing it, and the release agent layer (13) is formed by heating a composition for forming a release agent layer containing a melamine resin as a main component and polyorganosiloxane. It is formed by curing, the arithmetic average roughness Ra1 of the outer surface (131) is less than 8nm, and the maximum protrusion height Rp1 of the outer surface (131) is less than 50nm.

Description

technical field [0001] The present invention relates to a release film for producing a printed circuit board, a method for producing a release film for producing a printed circuit board, a method for producing a printed circuit board, and a printed circuit board. Background technique [0002] In the production of ceramic capacitors, a release film for printed circuit board production (hereinafter referred to as "release film") is used to form a printed circuit board. [0003] This release film generally consists of a base material and a release agent layer. A printed circuit board is formed on such a release film. In the production of a printed circuit board, ceramic particles and a binder resin are first dispersed in an organic solvent, and the dissolved ceramic slurry is applied to obtain a coated product. A printed circuit board is produced by drying this coated product. And the manufactured printed circuit board was peeled off from a peeling film, and it used for manu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28B1/30B05D5/00B05D7/24B32B27/00B32B27/42C09D5/20C09D161/28C09D183/04
CPCB32B27/42C09D161/28C08G77/16B32B7/06B32B27/08B32B27/283B32B2307/718C08L83/04C09D5/20
Inventor 深谷知巳
Owner LINTEC CORP
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