Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet

A technology for a printed circuit substrate and a manufacturing method, which is applied in the field of release films for the manufacture of printed circuit substrates, can solve the problems of local thickness and unevenness of pinholes that are prone to occur in printed circuit substrates, and achieve excellent peelability, excellent smoothness, and high reliability. Effect

Active Publication Date: 2016-10-12
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if a thin printed circuit board is manufactured using the conventional release film, problems such as pinholes and local thickness unevenness tend to occur on the surface of the printed circuit board.

Method used

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  • Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet
  • Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet
  • Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0219] First, prepare a biaxially oriented polyethylene terephthalate film [thickness: 31 mm, arithmetic average roughness Ra of the first surface] as a base material 2 : 23nm, the maximum protrusion height Rp of the first surface 2 : 415nm, the arithmetic mean roughness Ra of the second surface 3 : 23nm, the maximum protrusion height Rp of the second surface 3 : 415nm].

[0220] Then, 100 parts by mass of melamine resin [manufactured by Mitsui Cytec Co., Ltd., trade name "Symel 303", hexamethoxymethylmelamine, mass average molecular weight 390, solid content 100 mass %], and 5 p-toluenesulfonic acid as an acidic catalyst Parts by mass and a mixed solvent (mass ratio 4 / 1) of isopropanol and isobutanol were mixed to obtain a composition for forming a smoothing layer with a solid content of 15% by mass.

[0221] Then, the obtained composition for smoothing layer formation was apply|coated on the 1st surface 111 of the base material 11 with the bar coater, and the 1st coating ...

Embodiment 2

[0225] Except having used the composition for smoothing layer formation obtained as follows, and the composition for release agent layer formation, it carried out similarly to Example 1, and manufactured the release film for printed circuit board manufacture.

[0226] Melamine resin [manufactured by Mitsui Cytec Corporation, trade name "Symer 303", hexamethoxymethylmelamine, mass average molecular weight 390, solid content 100% by mass] 65 parts by mass, and a diol compound [2- Methyl-1,3-propanediol, manufactured by Tokyo Chemical Industry Co., Ltd., mass average molecular weight 90, solid content 100%] In a mixture of 30 parts by mass, 5 parts by mass of p-toluenesulfonic acid as an acidic catalyst, and isopropanol and isopropanol A mixed solvent of butanol (mass ratio 4 / 1) was used to obtain a composition for forming a smoothing layer with a solid content of 15% by mass.

[0227] In addition, 65 parts by mass of melamine resin [manufactured by Mitsui Cytec Co., Ltd., trade ...

Embodiment 3

[0229] Except using biaxially oriented polyethylene terephthalate film [thickness: 31mm, arithmetic mean roughness Ra of the 1st side 2 : 19nm, the maximum protrusion height Rp of the first surface 2 : 216nm, the arithmetic mean roughness Ra of the second surface 3 : 19nm, the maximum protrusion height Rp of the second surface 3 : 216 nm], except that it was used as a base material, it carried out similarly to Example 1, and produced the release film for printed circuit board manufacture.

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Abstract

This release film for green sheet manufacturing is characterized by the following: including a base material (11), a smoothing layer (12), and a release agent layer (13); the smoothing layer (12) is formed by heating and curing a smoothing layer formation composition that includes as the main component a melamine resin with a mass average molar weight of 950 or less; the release agent layer (13) includes a melamine resin as the main component, and is formed by heating and curing a release agent layer formation composition that includes polyorganosiloxane; the arithmetic mean roughness (Ra1) of an outer surface (131) being 8nm or less and the maximum projection height (Rp1) of the outer surface (131) being 50nm or less.

Description

technical field [0001] The present invention relates to a release film for producing a printed circuit board, a method for producing a release film for producing a printed circuit board, a method for producing a printed circuit board, and a printed circuit board. Background technique [0002] In the production of ceramic capacitors, a release film for printed circuit board production (hereinafter referred to as "release film") is used to form a printed circuit board. [0003] This release film generally consists of a base material and a release agent layer. A printed circuit board is formed on such a release film. In the production of a printed circuit board, ceramic particles and a binder resin are first dispersed in an organic solvent, and the dissolved ceramic slurry is applied to obtain a coated product. A printed circuit board is produced by drying this coated product. And the manufactured printed circuit board was peeled off from a peeling film, and it used for manu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/30B05D5/00B05D7/24B32B27/00B32B27/42C09D5/20C09D161/28C09D183/04
CPCB32B27/42C09D161/28C08G77/16B32B7/06B32B27/08B32B27/283B32B2307/718C08L83/04C09D5/20
Inventor 深谷知巳
Owner LINTEC CORP
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