Active element and fabricating method thereof
A technology of active components and manufacturing methods, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve problems such as excessive feed-through voltage, and achieve the effect of reducing feed-through voltage
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[0053] The manufacturing method of the active device according to an embodiment of the present invention is introduced as follows. first as Figure 2A As shown, a gate 110 is formed on a substrate 50 . The material of the substrate 50 can be glass, quartz, organic polymer, opaque / reflective material (such as conductive material, chip, ceramic, etc.) or other suitable materials. The material of the gate 110 is generally a metal material. But the present invention is not limited thereto. In other embodiments, the material of the gate 110 can also be other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, oxynitrides of metal materials, or metal materials. Stacked layers with other conductive materials.
[0054] Please refer to Figure 2A and Figure 2B , first as Figure 2B As shown, a first insulating layer 122 is formed on the substrate 50 and covers the gate 110 , and the first insulating layer 122 is distributed in a first re...
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