Etching apparatus

Abstract

The present invention discloses an etching apparatus. An etching apparatus according to an embodiment of the present invention is an etching apparatus for etching an object to be processed, comprising: a chamber providing a space for performing the etching; one or more spraying portions located in the chamber and spraying an etching solution on the object to be processed, a plurality of transfer rollers for moving the object to be processed, an suction part for sucking the etching solution on an upper surface of the object to be processed, wherein the suction part comprises one or more suction pipes. Each transfer roller includes a rotary shaft and a plurality of support members formed along a longitudinal direction of the rotary shaft. Each suction pipe is located between a support member of one transfer roller and a support member adjacent to the transfer roller.

Description

technical field [0001] Embodiments of the present invention relate to an etching device, in particular, to an etching device capable of completely preventing puddling without hindering the movement of a flexible thin substrate. Background technique [0002] Generally, etching (etching) is a pattern shape processing method. After masking the required part on the surface of the material to be processed (such as a printed circuit board), spray chemical to the remaining part through the nozzle. Chemicals (such as etching solution) to form the desired shape, this method has recently been widely used in the semiconductor manufacturing process. [0003] The quality of the products manufactured according to this etching processing method is generally related to the etching solution and the etching device. Specifically, various conditions such as the type, temperature, concentration, etc. of the etching solution, and the shape, number, size, interval, arrangement, and moving speed o...

AI Technical Summary

Problems solved by technology

However, since the suction rod 40 directly contacts the substrate 50, in the case where the substrate 50 is a thin substrate having flexibility (for example, a flexible printed circuit (FPC) substrate), the substrate 50 may be sucked by the suction port 41 of the suction rod 40. is attached to the suction port 41

As a result, the transfer of the substrate 50 by the upper roller 30a and the lower roller 30b cannot be normally performed, thereby reducing product production efficiency.

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