Polishing process and device for 3D arc surface of ceramic member

Abstract

Disclosed is a polishing process and device for a 3D arc surface of a ceramic member. The polishing process includes: A, clamping a product needing arc surface polishing by a clamp, enabling a to-be-polished face of the product to be exposed outside, and mounting a polishing belt on a machine capable of adjusting horizontal and vertical positions of the belt; B, adjusting positions of the polishing belt and the to-be-polished face of the product to enable the polishing belt to compress the to-be-polished face of the product and to completely contact with an arc surface of the to-be-polished face of the product; C, spraying a polishing liquid into a contact face of the product and the polishing belt, and controlling the polishing belt to rotate to polish the to-be-polished face of the product. The device comprises the clamp and the polishing belt. By using the polishing process and device, processing requirements on surface coarseness of ceramic structural member polishing can be met, over-polishing of holes in the arc surface is avoided, the process is simple, defects like grinding wheel lines and tool marks on the arc surface can be well removed, processing yield can be increased effectively, and production cost can be saved.

Description

technical field [0001] The invention relates to a polishing process and a device of a 3D arc surface of a ceramic piece. Background technique [0002] Ceramic is a multi-functional oxide crystal that integrates excellent physical and chemical properties. Its hardness is second only to diamond and reaches Mohs level 9. At the same time, the compactness of ceramics makes it have a large surface tension. The above characteristics are very suitable for mobile phones. , watches, cameras and other electronic product structural parts. [0003] In order to meet the requirements of the development of ceramic optical devices and obtain a surface with high flatness and high brightness, chemical mechanical polishing of ceramics must be carried out to reduce or eliminate the scratches on ceramic panels in the process of ceramic cutting and grinding, and obtain high flatness. , High brightness products. [0004] At present, conventional plane polishing or special-shaped polishing proces...

AI Technical Summary

Problems solved by technology

This process has the limitation that it can only polish the 2D surface, and the processing effect on the 2.5D and 3D surfaces is poor; for the special-shaped polishing of the 2.5D and 3D surfaces, a brush is generally used to polish the opposite surface (generally 2.5D surface or 3D surface) ) for sweeping and grinding processing, but because the contact between the brush and the arc surface is point contact, this process has the following disadvantages: 1. When processing products with holes on the arc surface, the holes will be over-polished; 2. The amount of removal at different positions on the arc surface is inconsistent, resulting in deformation of the product profile

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