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A cmp polishing pad dresser

A dresser and polishing pad technology, applied in the direction of grinding/polishing equipment, abrasive surface adjustment devices, grinding machine parts, etc., can solve the problems of scratching the wafer surface, debris clogging, falling off, etc., to reduce damage Effect

Active Publication Date: 2018-09-04
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These traditional dressers have the following problems: the diamond particles on the dressing disc are easy to fall off on the surface of the dressing disc, and are likely to be stuck on the surface of the chemical polishing pad, thereby scratching the surface of the wafer
However, it is easy to be blocked by debris between the cutting blades, which weakens its dressing effect on the polishing pad

Method used

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  • A cmp polishing pad dresser
  • A cmp polishing pad dresser
  • A cmp polishing pad dresser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Such as Figure 1-Figure 5 Shown, a kind of CMP polishing pad conditioner comprises disc-shaped base body 1 and the trimming part that is positioned at described disc-shaped base body 1, and described trimming part is ring-shaped trimming part 2, and the upper surface of described ring-shaped trimming part 2 is provided with many A micro-protrusion and a plurality of micro-holes 3, the micro-holes 3 communicate with the annular cavity 5 located in the disc-shaped base 1 through the channel 4, the axis of the micro-holes 3 is connected with the ring-shaped trimming member 2. The included angle of the upper surface is 90°.

[0053] The plurality of micro-protrusions are distributed on the annular trimming component 2 in a radial matrix.

[0054] One microhole 3 is provided between every adjacent four microprotrusions.

[0055] The trimmer also includes a sealing cover plate 6 for sealing the end of the annular cavity 5 away from the tunnel 4, a sealing ring 7 is arrange...

Embodiment 2

[0061] Such as Figure 6 and Figure 7 Shown, a kind of CMP polishing pad dresser, and the difference characteristic of a kind of CMP polishing pad dresser disclosed in embodiment 1 is that, described microprotrusion is quadrangular pyramid 12, and the outer surface of described quadrangular pyramid 12 and the The outer surface of the annular trimming member 2 is provided with a micro-diamond coating 13, the thickness of the micro-diamond coating 13 is 100 μm, and the bottom side of the quadrangular pyramid 12 is 1 mm in length and 1 mm in height. Micro-diamond coating can be achieved by methods such as electroplating and chemical vapor deposition.

Embodiment 3

[0063] Such as Figure 8-Figure 11 As shown, a CMP polishing pad dresser includes a disc-shaped substrate 1 ′ and a trimming component positioned on the disc-shaped substrate 1 ′, the trimming component is an annular trimming component 2 ′, and on the annular trimming component 2 ′ The surface is provided with a plurality of micro-protrusions and a plurality of micro-holes 3', and the micro-holes 3' communicate with the annular cavity 5' located in the disc-shaped base 1' through the channel 4', and the micro-holes 3' The angle between the axis of and the upper surface of the annular trimming component 2' is 90°. The shape of the microhole is circular, the diameter of the microhole 3' is 2 mm, and the depth of the channel 4' is 10 mm.

[0064] The plurality of micro-protrusions are distributed in radial matrix on the annular trimming component 2'.

[0065] The lower part of the annular trimming part 2 ′ is provided with a sealing cover plate 6 ′ for sealing the annular cavit...

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Abstract

The invention discloses a novel CMP polishing pad finisher. The novel CMP polishing pad finisher is characterized by comprising a disc-shaped body and a finishing part located on the disc-shaped body, wherein a plurality of micro protrusions and a plurality of micro holes are formed in the upper surface of the finishing part; the micro holes are communicated with a cavity in the disc-shaped body; axes of the micro holes are vertical to the upper surface of the finishing part; or an included angle being smaller than 90 degrees is formed between the axes of the micro holes and the finishing part. Through the micro-hole structure of the novel CMP polishing pad finisher, the problem of the blockage in the finishing process can be solved; the damage of chippings to the polishing pads can be reduced; the novel CMP polishing pad finisher comprises a micro-protrusion structure with a certain conical degree; the size of the top of the micro-protrusion structure is smaller than that of the bottom, namely the angles of the cutting surfaces of the micro protrusions are greater than 90 degrees; the structure has the effect of accommodating the chippings in the finishing process and is capable of finishing the polishing pads with low damage.

Description

technical field [0001] The invention relates to a CMP (chemical mechanical polishing) polishing pad dresser, which can realize high-efficiency and low-damage dressing of the polishing pad and improve the polishing quality of chemical mechanical polishing. Background technique [0002] With the advancement of science and technology, the precision requirements for the surface of semiconductors, sapphires, ceramic materials, etc. are increasing, and high-precision processing at the nanometer level is required. At present, the method to achieve this high-precision requirement is usually the means of chemical mechanical polishing (CMP). [0003] The principle of chemical mechanical polishing is that during chemical mechanical polishing, the rotating workpiece is pressed against the rotating polishing pad with a certain pressure, and the chemical solution in the polishing liquid reacts with the surface of the workpiece to change the physical properties of the surface of the workpi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12
Inventor 董志刚康仁科段佳冬朱祥龙周平
Owner DALIAN UNIV OF TECH