A device for measuring clay adhesion and using method thereof
An adhesion and clay technology, applied in the field of the device for measuring the adhesion of clay and the device for measuring the adhesion of clay, can solve the problems of not considering the drainage consolidation conditions and the amount of clay adhesion, etc.
Active Publication Date: 2018-10-30
CENT SOUTH UNIV
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Problems solved by technology
Zumsteg (Tunnelling & Underground Space Technology, 2012, 31(5): 86-96.) embedded a thin metal plate in clay, applied different pressures on the upper part of the soil sample, used a motor to drive the metal plate to rotate and recorded the rotational torque in real time, and measured Adhesion strength between soil and metal plate under different pressure and shear conditions, but does not consider drainage consolidation conditions, and does not consider the adhesion of clay on the metal plate
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[0035] The device for measuring clay adhesion provided by the present invention and its application method will be described in detail below in conjunction with the accompanying drawings.
[0036] see figure 1 , figure 2 and image 3, the device for measuring clay adhesion provided by the present invention, a lever loading device is installed on the test bench 11, and the lever loading device includes a balance bracket 14 and a lever bracket 15, and the balance bracket 14 is connected with the first pin shaft and the The lever frame 15 is connected, and one end of the lever frame 15 is provided with a loading slot 16, and the loading slot 16 can hold dry sand and pressurized weights for initial balance, and the other end is connected with the second pin shaft 10 to set The connection plate 9 at the bottom of the test base 8 is connected, and the top of the test base 8 is provided with a sample chamber 7, and the sample chamber 7 is provided with a drainage hole 6 and a disp...
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The invention discloses a device for measuring the adhesion of clay and a using method of the device. A lever loading device is installed on a test board and comprises a balancing support and a lever frame. The balancing support is connected with the lever frame through a first pin shaft, a loading trough is arranged at one end of the lever frame, the other end of the lever frame is connected with a connecting plate arranged at the bottom of the testing base through a second pin shaft, a sample cavity is formed in the upper portion of a testing base and provided with a water drainage hole and a displacement meter, scale marks are marked on the inner wall of the sample cavity, a pressing plate matched with the sample cavity is arranged on the upper portion of the sample cavity, the pressing plate is connected with a main shaft of a servo motor located on the upper portion of the pressing plate, a torque sensor is arranged on the main shaft, and the servo motor is connected with a motor support fixed to the test board through a motor rear seat and is in communication with a controller. The device can measure the adhesion of clay at different pressures, different shearing speeds and different consolidation degrees.
Description
technical field [0001] The invention relates to an adhesion measuring device, in particular to a device for measuring the adhesion of clay. The invention also relates to a method of using the device for measuring clay adhesion. Background technique [0002] The phenomenon of soil adhesion widely exists in life and is a problem that plagues many industries. In agricultural production, the soil adheres to the plow, leading to an increase in traction resistance; when the dump truck loads clay, a large amount of soil adheres to the compartment, resulting in a reduction in the amount of soil transported and increased energy consumption; on excavators, loaders and other machinery After the clay is adhered, the bulldozing resistance increases, the amount of soil loaded by the machine decreases, and the work efficiency is greatly reduced; when the earth pressure balance shield is constructed in the clay layer, the clay adheres to the cutterhead and the cutter, causing the cutterhea...
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IPC IPC(8): G01N5/00G01N19/04
CPCG01N5/00G01N19/04
Inventor 刘朋飞王树英阳军生瞿同明胡钦鑫傅金阳
Owner CENT SOUTH UNIV