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Cylindrical electro-hydro dynamic micro-pump and manufacturing method therefor

A cylindrical, electrofluidic technology, applied in the direction of electric components, manufacturing motor generators, electrical components, etc., can solve the problems of inaccurate flow control, large noise, large volume, etc., achieve efficient and stable operation, simple processing and preparation, and enhanced The effect of drag and drop

Inactive Publication Date: 2016-11-16
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional mechanical pumps have disadvantages such as large volume, high power consumption, high noise, and inaccurate flow control.

Method used

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  • Cylindrical electro-hydro dynamic micro-pump and manufacturing method therefor
  • Cylindrical electro-hydro dynamic micro-pump and manufacturing method therefor
  • Cylindrical electro-hydro dynamic micro-pump and manufacturing method therefor

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Embodiment

[0027] Such as Figures 1 to 3 shown. The invention discloses a cylindrical electrohydrodynamic micropump, which comprises a cylindrical pump casing 1 and an electrode array 2 arranged therein; the electrode array 2 includes mutually spaced cathodes and anodes, and the cathodes and anodes pass The electrode wire 3 welded thereon is connected with the power source outside the cylindrical pump casing 1 . The electrode array 2 (FPC) is manufactured by using a flexible circuit board as a substrate through a peeling process.

[0028] A cathode in the electrode array 2 and an anode adjacent thereto form a group of electrode pairs, and the cathodes and anodes are alternately arranged. The electrode wire 3 can be enameled wire, which has better corrosion resistance and insulation performance. The electrode array 2 is rolled into an elastic cylindrical structure, and closely adheres to the inner wall of the cylindrical pump casing 1 . The electrode array 2 is fixed axially and radi...

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Abstract

The invention discloses a cylindrical electro-hydro dynamic micro-pump and a manufacturing method therefor. The cylindrical electro-hydro dynamic micro-pump comprises a cylindrical pump shell and an electrode array arranged in the cylindrical pump shell, the electrode array comprises cathodes and anodes that are arranged at an interval, the electrode array is rolled into an elastic cylindrical structure and is closed attached to an inner wall face of the cylindrical pump shell, and the electrode array is axially and radially fixed via friction force between the electrode array and the inner wall face of the cylindrical pump shell; according to the cylindrical electro-hydro dynamic micro-pump, a flat plate-shaped flexible circuit board is rolled into a cylindrical shape and is placed in the cylindrical pump shell; because each electrode sheet is made of elastic metal material, the flat plate-shaped flexible circuit board along with the electrode array can be completely attached to an inner wall of the pump shell the via use of elastic force of each electrode sheet; a technical structure of the cylindrical electro-hydro dynamic micro-pump is characterized by simple processing, high-efficiency and stable operation, and application to the fields of microfluid cooling systems, medicine delivery systems, micro-electro-mechanical systems and the like.

Description

technical field [0001] The invention relates to the fields of fluid power and micromanufacturing, in particular to a cylindrical electrohydrodynamic micropump and a manufacturing method thereof. Background technique [0002] With the development of electronic manufacturing technology, the integration of electronic components is getting higher and higher. Moore's Law states that the transistor density of integrated circuits doubles every 18 months. The higher the integration of electronic components, the greater the heat flux. The reliability and life of electronic components will increasingly depend on the perfection of the thermal control system. Relevant studies have shown that for every 10°C increase in the operating temperature of electronic components, the reliability of the system and the life of electronic components will decrease by about half. At present, the heat dissipation power of high heat flow devices has reached the order of 〖10〗^6w / m^2, and the heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02K44/02H02K15/00
CPCH02K15/00H02K44/02
Inventor 万珍平冯晨王小伍汤勇吴锐成冯睿东
Owner SOUTH CHINA UNIV OF TECH
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