Manufacturing method of printed circuit board substrate with low copper surface roughness

Abstract

The invention discloses a manufacturing method of a printed circuit board substrate with low roughness on a copper surface. The manufacturing method comprises the following steps: firstly, carrying out hot pressing solidification on a prepreg, covering a piece of release paper on the prepreg subjected to the hot pressing solidification, laminating, and then tearing off the release paper, so that a copper-free substrate is produced; secondly, depositing a first thin copper layer on the copper-free substrate; thirdly, making a light sensation membrane provided with patterns on the first thin copper layer by adopting a light sensation membrane image transfer method; fourthly, plating a second copper layer by adopting an electroplating method; fifthly, removing the light sensation membrane, and removing the first thin copper layer in a rapid etching manner, so that only a high-resolution pattern circuit coating is left. The invention provides a manufacturing method of a printed circuit board substrate with low roughness on the copper surface, so that signal stability of a printed circuit board is improved, and good dimensional stability during final lamination is realized.

Description

technical field [0001] It relates to the field of electric component manufacturing, in particular to a method for manufacturing a printed circuit board substrate. Background technique [0002] The production method of printed circuit boards is to use the etching copper removal method to make the copper foil substrate into an inner layer with independent circuits; while the lamination process will require roughening of the bonding surface of the copper foil or covering it with a layer of bonding substance, a typical method The copper surface on the bonding surface is rougher than the copper surface on the top surface, and the two sides of the circuit are not vertical because they are formed by etching, so the circuit looks more like a trapezoid than a rectangle. This change It is related to the copper thickness, and the higher the copper thickness, the more obvious; when a thicker copper layer is used, the manufacturing method of the prior art will limit the line width and th...

AI Technical Summary

Problems solved by technology

[0002] The production method of printed circuit boards is to use the etching copper removal method to make the copper foil substrate into an inner layer with independent circuits; while the lamination process will require roughening of the bonding surface of the copper foil or covering it with a layer of bonding substance, a typical method The copper surface on the bonding surface is rougher than the copper surface on the top surface, and the two sides of the circuit are not vertical because they are formed by etching, so the circuit looks more like a trapezoid than a rectangle. This change It is related to the copper thickness, and the higher the copper thickness, the more obvious; when a thicker copper layer is used, the manufacturing method of the prior art will limit the line width and the surface of the copper layer will appear rough, which will reduce the substrate and other components. Dimensional stability of the material upon final lamination; prior art has not addressed such issues