Maize and mushroom interplanting planting method

A planting method, technology of shiitake mushrooms, applied in the field of crop cultivation, can solve problems such as not being able to meet market demand, single shiitake mushroom varieties, etc., achieve the effect of increasing land output rate, increasing multiple cropping index, and alleviating land conflicts

Inactive Publication Date: 2016-11-30
何林春
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the shiitake mushroom that this cultivation method produces has single species, can not satisfy the problem of market demand

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A planting method for corn interplanting shiitake mushrooms, comprising the following steps:

[0018] ⑴Site selection and land preparation: In areas with an altitude of 2150m, select neutral or slightly acidic flat land and gentle slope plots with loose and fertile soil, deep soil layer, good drainage and irrigation, and sandy soil, and plow 35cm deep, level it with rakes, and raise high ridges , the ridge height is 32cm, the ridge width is 65cm, and the ridge spacing is 50cm;

[0019] (2) Cultivation of corn and potatoes: In mid-April, a row of potato seed potatoes was planted in holes on the side of the ridge with a plant spacing of 20cm, and the whole ground was covered with black plastic film. Two rows of corn seedlings were transplanted on the top of the ridge with a row spacing of 30cm and a plant spacing of 25cm;

[0020] (3) Cultivation of shiitake mushrooms: In late April, spread a layer of sterilized nutrient substrate on the plastic film in the ditch, the thi...

Embodiment 2

[0024] A planting method for corn interplanting shiitake mushrooms, comprising the following steps:

[0025] ⑴Site selection and land preparation: In areas with an altitude of 2150m, select neutral or slightly acidic flat land and gentle slope plots with loose and fertile soil, deep soil layer, good drainage and irrigation, and sandy soil, and plow 40cm deep, level it with rakes, and raise high ridges , the ridge height is 35cm, the ridge width is 75cm, and the ridge spacing is 65cm;

[0026] (2) Cultivation of corn and potatoes: In late April, sow a row of potato seed potatoes on the side of the ridge with a plant spacing of 25cm, cover the whole ground with black plastic film, and transplant two rows of corn seedlings on the top of the ridge with a row spacing of 35cm and a plant spacing of 30cm;

[0027] (3) Cultivation of shiitake mushrooms: at the end of April, spread a layer of sterilized nutrient substrate on the mulch film in the furrow, the thickness of the nutrient s...

Embodiment 3

[0031] A planting method for corn interplanting shiitake mushrooms, comprising the following steps:

[0032] ⑴Site selection and land preparation: In areas with an altitude of 2300m, select neutral or slightly acidic flat land and gentle slope plots with loose and fertile soil, deep soil layer, good drainage and irrigation, and sandy soil, and plow 40cm deep, level it with rakes, and raise high ridges , the ridge height is 35cm, the ridge width is 70cm, and the ridge spacing is 60cm;

[0033] (2) Cultivation of corn and potatoes: In late April, sow a row of potato seed potatoes on the side of the ridge with a plant spacing of 22cm, cover the whole ground with black plastic film, and transplant two rows of corn seedlings on the top of the ridge with a row spacing of 33cm and a plant spacing of 28cm;

[0034] (3) Cultivation of shiitake mushrooms: at the end of April, spread a layer of sterilized nutrient substrate on the mulch film in the ditch, the thickness of the nutrient su...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a maize and mushroom interplanting planting method and belongs to the technical field of crop cultivation. The method includes the steps of 1, land selection and preparation; 2, maize and potato cultivation; 3, mushroom cultivation. Maize, potatoes and mushrooms are cultivated in a stereoscopic mode, the cropping index of land is increased, the crop land contention conflict is relieved, the land is fully utilized, and the land output capacity is improved. The whole planting process is carried out in a field, and operation is easy.

Description

technical field [0001] The invention belongs to the technical field of crop cultivation, in particular to a method for planting shiitake mushrooms interplanted with corn. Background technique [0002] Corn, also known as maize, fairy wheat, corn, corn, and cob, is an important food crop and an important source of feed. It is also the food crop with the highest total output in the world, higher than that of rice. At the same time, corn is an annual herbaceous plant of the family Grass, which takes a long time to plant, and the row spacing of corn is also relatively large. Therefore, a large part of the remaining space in the seedling stage of corn is not well utilized. Relatively speaking, the economic benefit per unit area is relatively low. [0003] Shiitake mushrooms are delicious, fragrant, and nutritious, known as the "Queen of Plants". At present, the artificial cultivation of shiitake mushrooms is mainly made of wood chips from oak, birch, maple, locust tree, poplar, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): A01G1/00A01G1/04C05G1/00
CPCA01G18/00A01G22/00C05B3/00C05D9/02C05F3/00C05F5/002C05F11/00
Inventor 何林春
Owner 何林春
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products