Processing method of PCB (printed circuit board) laminate realizing uniform edge gumming, laminate and PCB

A processing method and technology for laminates, applied in the field of laminates and PCB boards, can solve the problems of insufficient glue flow in the insulation area of ​​the core board frame, extremely high requirements for lamination parameters, and increased production processes, so as to overcome the lack of glue flow and pressure. Combine foaming, ensure product quality stability, and overcome the effects of numerous production processes

Inactive Publication Date: 2016-12-07
四川英创力电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The lamination of copper-based core boards is different from the lamination of conventional four-layer boards and multi-layer boards. If the traditional lamination structure is used for lamination, the requirements for the glue content of PP and the lamination parameters are extremely high, and it is very easy for the core board to appear. Insufficient flow of glue in the insulating area of ​​the frame, pressing bubbles and other undesirable phenomena, resulting in poor quality and scrapping, increasing production costs
[0003] At present, the industry has introduced the resin plugging process to improve, that is, the resin is inserted into the core board hole / groove by silk screen printing, and after high temperature curing, the resin and the base copper are flattened by multiple wire drawing, and then the pressing process is carried out. However, the production process of this process increases, the production efficiency is low, and the production cost increases
[0004] The resin plugging process needs to dry the copper-based core board (or paste high-temperature glue), drill air holes, silk screen (plug resin), heat-cure, remove the dry film (or tear off the high-temperature glue) and draw and polish the copper-based core board before pressing. , and then press the board after stacking the copper-based core board, copper foil and insulating board, the process is very complicated

Method used

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  • Processing method of PCB (printed circuit board) laminate realizing uniform edge gumming, laminate and PCB
  • Processing method of PCB (printed circuit board) laminate realizing uniform edge gumming, laminate and PCB
  • Processing method of PCB (printed circuit board) laminate realizing uniform edge gumming, laminate and PCB

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Such as Figure 1-7 As shown in the figure, a PCB laminate with uniform glue flow at the edge of the board includes a copper-based unit, an upper copper foil 3 and a lower copper foil 4, the copper-based unit is located between the upper copper foil 3 and the lower copper foil 4, and the upper copper-based unit , and the lower surface are closely attached to the upper copper foil 3 and the lower copper foil 4 respectively.

[0040] There are multiple copper-based units, and each copper-based unit is composed of a copper-based core board 1, an FR-4 outer frame 2, an upper insulating sheet 6 and a lower insulating sheet 7, and the copper-based core board 1 is placed on the FR-4 outer frame 2 Inside, the upper insulating sheet 6 and the lower insulating sheet 7 clamp the copper-based core board 1 and the FR-4 outer frame 2 in the middle, and stick to each other.

[0041] The copper-based core board 1 and the FR-4 outer frame 2 match each other, and the concave part 11 of ...

Embodiment 2

[0046] A method for processing a PCB laminate with uniform edge flow glue in Embodiment 1, comprising the following steps:

[0047] (1) FR-4 frame production.

[0048] ① Take FR-4 epoxy board, the thickness of the board is 0.05-0.1mm smaller than the thickness of the copper-based core board.

[0049] ② Drill positioning holes and rivet holes.

[0050] ③ Gong frame, the frame out of the gong fits just outside the copper-based core board and fits closely.

[0051] (2) Take the copper-based core board, and embed the copper-based core board into the FR-4 outer frame produced in step (1).

[0052] (3) Riveting and prefolding

[0053] Take the 2116 high-glue PP board and copper foil, stack the lower copper foil, 2116 high-glue PP board, copper-based core board with FR-4 outer frame, 2116 high-glue PP board, upper copper foil from bottom to top, and then Riveting into laminates with rivets.

[0054] (4) Pressure plate. The riveted laminate is pressed, and the pressed plate is f...

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Abstract

The invention discloses a processing method of a PCB (printed circuit board) laminate realizing uniform edge gumming. The processing method comprises steps as follows: (1), an FR-4 outer frame is manufactured; (2), a copper-based core board is taken and embedded into the FR-4 outer frame manufactured in the step (1); (3), riveting and overlapping are performed; (4), a board pressing step is executed, the riveted laminate is subjected to board pressing including hot pressing and cold pressing in sequence. Compared with the prior art, the PCB laminate realizing the uniform edge gumming solves the problems of insufficient gumming and bubbling during press fit in the prior art, guarantees quality stability of a product and reduces the production cost.

Description

technical field [0001] The invention belongs to the field of PCB processing, and in particular relates to a processing method of a PCB laminate with uniform edge flow glue, a laminate and a PCB. Background technique [0002] The lamination of copper-based core boards is different from the lamination of conventional four-layer boards and multi-layer boards. If the traditional lamination structure is used for lamination, the requirements for the glue content of PP and the lamination parameters are extremely high, and it is very easy for the core board to appear. Insufficient flow of glue in the insulating area of ​​the frame, pressing bubbles and other undesirable phenomena will result in poor quality and scrapping, increasing production costs. [0003] At present, the industry has introduced the resin plugging process to improve, that is, the resin is inserted into the core board hole / groove by silk screen printing, and after high temperature curing, the resin and the base co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/30B32B15/04B32B3/08B32B27/06B32B27/32B32B37/10B32B37/06B32B37/08
CPCB32B3/30B32B3/085B32B15/04B32B27/06B32B27/32B32B37/06B32B37/08B32B37/1018B32B2309/022B32B2309/025B32B2309/125B32B2309/68B32B2457/08
Inventor 李清华艾克华
Owner 四川英创力电子科技股份有限公司
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