Processing method of PCB (printed circuit board) laminate realizing uniform edge gumming, laminate and PCB

Abstract

The invention discloses a processing method of a PCB (printed circuit board) laminate realizing uniform edge gumming. The processing method comprises steps as follows: (1), an FR-4 outer frame is manufactured; (2), a copper-based core board is taken and embedded into the FR-4 outer frame manufactured in the step (1); (3), riveting and overlapping are performed; (4), a board pressing step is executed, the riveted laminate is subjected to board pressing including hot pressing and cold pressing in sequence. Compared with the prior art, the PCB laminate realizing the uniform edge gumming solves the problems of insufficient gumming and bubbling during press fit in the prior art, guarantees quality stability of a product and reduces the production cost.

Description

technical field [0001] The invention belongs to the field of PCB processing, and in particular relates to a processing method of a PCB laminate with uniform edge flow glue, a laminate and a PCB. Background technique [0002] The lamination of copper-based core boards is different from the lamination of conventional four-layer boards and multi-layer boards. If the traditional lamination structure is used for lamination, the requirements for the glue content of PP and the lamination parameters are extremely high, and it is very easy for the core board to appear. Insufficient flow of glue in the insulating area of ​​the frame, pressing bubbles and other undesirable phenomena will result in poor quality and scrapping, increasing production costs. [0003] At present, the industry has introduced the resin plugging process to improve, that is, the resin is inserted into the core board hole / groove by silk screen printing, and after high temperature curing, the resin and the base co...

AI Technical Summary

Problems solved by technology

[0002] The lamination of copper-based core boards is different from the lamination of conventional four-layer boards and multi-layer boards. If the traditional lamination structure is used for lamination, the requirements for the glue content of PP and the lamination parameters are extremely high, and it is very easy for the core board to appear. Insufficient flow of glue in the insulating area of ​​the frame, pressing bubbles and other undesirable phenomena, resulting in poor quality and scrapping, increasing production costs

[0003] At present, the industry has introduced the resin plugging process to improve, that is, the resin is inserted into the core board hole / groove by silk screen printing, and after high temperature curing, the resin and the base copper are flattened by multiple wire drawing, and then the pressing process is carried out. However, the production process of this process increases, the production efficiency is low, and the production cost increases

[0004] The resin plugging process needs to dry the copper-based core board (or paste high-temperature glue), drill air holes, silk screen (plug resin), heat-cure, remove the dry film (or tear off the high-temperature glue) and draw and polish the copper-based core board before pressing. , and then press the board after stacking the copper-based core board, copper foil and insulating board, the process is very complicated

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