Method, device and system for preventing condensation of power component

A power component and anti-condensation technology, which is applied in the direction of condensation prevention, heating and ventilation control system, heating and ventilation safety system, etc., can solve the problem that the anti-condensation and heat dissipation of power components cannot be realized synchronously, and guarantees Reliability, the effect of preventing excessive stress and strain

Inactive Publication Date: 2016-12-07
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present invention provide a power component anti-condensation method, device, and system to solve the problem that power component anti-condensation and heat dissipation cannot be realized synchronously in the prior art

Method used

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  • Method, device and system for preventing condensation of power component
  • Method, device and system for preventing condensation of power component
  • Method, device and system for preventing condensation of power component

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0030] figure 1 It is a flow chart of the anti-condensation method for power components according to an embodiment of the present invention, such as figure 1 As shown, the method includes the following steps (step S101-step S102):

[0031] Step S101, detecting whether condensation occurs in the power components;

[0032] Step S102, when it is detected that condensation occurs in the power components, the cooling amount of the refrigerant is adjusted to eliminate the condensation.

[0033] In this embodiment, by detecting whether there is condensation in the power components, the cooling amount of the refrigerant is controlled, and the heat dissipation of the power components can be realized simultaneously, so as to prevent excessive stress and strain of the power components, and problems such as premature aging of the main board caused by alternation of cold and heat; and It can realize no condensation and ensure the reliability of the unit; it can also meet the capacity req...

Embodiment 2

[0039] In this embodiment, the anti-condensation method is introduced by taking power components of an air conditioner as an example. Of course, it is not limited to an air conditioner, and can also be applied to other electrical equipment. figure 2 It is a flowchart of the anti-condensation method according to an embodiment of the present invention, such as figure 2 As shown, the method includes the following steps (step S201-step S208):

[0040] In step S201, the air conditioner is turned on.

[0041]Step S202, detecting that the temperature of the power component reaches a protection threshold through the thermistor, and the protection threshold can be set based on requirements.

[0042] Step S203, detecting the ambient temperature and relative humidity of the environment where the power components are located through the temperature sensor and the humidity sensor, wherein the ambient temperature is also called dry bulb temperature.

[0043] Step S204, determine the dew...

Embodiment 3

[0049] corresponds to figure 1 The power component anti-condensation method introduced, this embodiment provides a power component anti-condensation device, such as image 3 The structural block diagram of the anti-condensation device for power components shown, the device includes:

[0050] The detection module 10 is used to detect whether condensation occurs in the power components;

[0051] The adjustment module 20 is configured to adjust the cooling capacity of the refrigerant to eliminate the condensation when condensation is detected in the power components.

[0052] In this embodiment, by detecting whether there is condensation in the power components, the cooling amount of the refrigerant is controlled, and the heat dissipation of the power components can be realized simultaneously, so as to prevent excessive stress and strain of the power components, and problems such as premature aging of the main board caused by alternation of cold and heat; and It can realize no ...

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PUM

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Abstract

The invention discloses a method, device and system for preventing condensation of a power component. The method comprises the steps of detecting whether the power component is condensed or not, and adjusting the cooling amount of a refrigerant when it is detected that the power component is condensed so that condensation can be eliminated. By the application of the technical scheme, by detecting whether the power component is condensed or not, the cooling amount of the refrigerant is controlled, cooling for the power component can be achieved synchronously, and the problem that a mainboard is aged in advance due to overhigh stress strain of the power component and alternate cooling and heating is solved; the purpose that the power component is free of condensation can be achieved, and reliability of a unit is ensured; and the capacity demand of the unit can also be met, and condensation prevention in a frequency reducing mode or frequency limiting mode or other modes is not needed.

Description

technical field [0001] The present invention relates to the technical field of air conditioners, in particular to a method, device and system for preventing condensation of power components. Background technique [0002] In related technologies, the anti-condensation solutions for power components are mainly as follows: [0003] The first solution: the heat-absorbing part of the cooling component forms a heat conduction connection with the surface of the power components of the frequency converter, and determines whether to turn on heat conduction by judging the surface temperature of the power components and the predetermined cooling action temperature, thereby preventing frequency conversion Condensed water is generated on the surface of the power components of the device, but the discontinuity of its opening makes the thermal stress of the motherboard serious, resulting in problems such as deformation and aging, which cannot protect the power component motherboard well. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F11/00F24F13/22
CPCF24F2110/10F24F11/30F24F11/62F24F11/64F24F11/83F24F11/84F24F13/22F24F2110/00F24F2110/20
Inventor 邹大枢刘志孝李健成李胤媛刘佳欢胡灯耀梁桂源
Owner GREE ELECTRIC APPLIANCES INC
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