Display panel reduction method and display device

Abstract

The present invention provides a display panel reduction method. The display panel comprises an array substrate with the paired box arrangement and a paired box substrate, and the array substrate and the surface departing from the paired box substrate both have a plurality of depression structures. The reduction method comprises: at least performing preprocessing of the paired box substrate; and employing an etching liquid to perform etching of the paired box substrate and the surface departing from the array substrate. The preprocessing comprises: forming protective layers on the surfaces of the depression structures to allow the depression structures to be filled with the protective layers; forming the protective layers by using materials which cannot be etched by the etching liquid; and removing the portions of the protective layers located out of the depression structures, and retaining the portions of the protective layers located in the depression structures. Correspondingly, the present invention further provides a display device. The display panel reduction method and the display device can improve the display effect while realizing the panel thinness.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for thinning a display panel and a display device. Background technique [0002] At present, in the production process of the display device, the upper and lower substrates of the display panel are usually subjected to a slimming process to obtain an ultra-thin display panel, and the viewing angle range can be enlarged after the thickness of the upper substrate is thinned. At present, etching solutions such as concentrated sulfuric acid and hydrofluoric acid are often used to react with the substrate for chemical thinning. In the process steps before chemical thinning, tiny recessed structures 1 (such as Figure 1a As shown), its opening and depth are several microns; when the subsequent thinning process is performed, the recessed structure 1 will become larger after being etched by the etching solution (such as Figure 1b As shown), this leads to the unevenness of the...

AI Technical Summary

Problems solved by technology

In the process steps before chemical thinning, tiny recessed structures 1 (such as Figure 1a As shown), its opening and depth are several microns; when the subsequent thinning process is performed, the recessed structure 1 will become larger after being etched by the etching solution (such as Figure 1b shown), which leads to the unevenness of the display surface of the thinned display panel, which affects the display effect, and when the concave structure 1 is large, it will also have a certain impact on the actual effect

Images