Bonding device

Abstract

The bonding device comprises a table 52 provided to be movable in a Y-axis direction with respect to a base 41, a first reaction member 58A and a second reaction member 58B respectively provided to be movable in the Y-axis direction with respect to the base 41. The first reaction member 58A and the second reaction member 58B are constituted in such a way as to move, when the table 52 moves in the Y-axis direction, in the opposite direction to the table 52 in the Y-axis direction. The first reaction member 58A and the second reaction member 58B are disposed respectively on both sides in the X-axis direction of the table 52. The first reaction member 58A and the second reaction member 58B are disposed in such a way that the center of gravity of the first reaction member 58A and second reaction member 58B is at a position that is based on the center of gravity of the table 52. In this way, a bonding device is provided, capable of improving the weight balance at the base while suppressing an increase in space.

Description

technical field [0001] Several embodiments of the present invention relate to a die bonding device. Background technique [0002] Conventionally, as such a die bonding device, there is known a die bonding device in which an X-axis linear motor has a coil part including a three-phase coil as a moving part and a yoke part as a fixed part, and the yoke part passes through the The yoke part guide that can move in the same axial direction as the coil part is fixed to the base (pedestal) to absorb the reaction force when the coil part moves; and there is an XY stage (such as Refer to Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2012-114359 [0006] In the die bonding apparatus of Patent Document 1, the yoke portion moves in the X-axis direction opposite to the coil portion, thereby absorbing the reaction force of the movement of the moving table by the X-axis linear motor, thereby preventi...

AI Technical Summary

Problems solved by technology

[0008] However, generally speaking, since the die bonding device is a long stroke with a long moving distance in the driving direction, if the stage and the reaction member are arranged in the driving direction as in the conventional die bonding device, the space in the driving direction will be large. Amplitude increase

Furthermore, disposing both the platform and the reaction member in the driving direction causes the center of gravity of the platform and the reaction member to deviate greatly, thereby deteriorating the weight balance of the pedestal supporting the platform and the reaction member.

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