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Fingerprint sensor module and manufacturing method thereof

A technology of a fingerprint sensor and a manufacturing method, applied in the field of sensors

Inactive Publication Date: 2016-12-21
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention proposes a fingerprint sensor module and its manufacturing method to solve the problems existing in the existing fingerprint sensor module, improve the reliability of the fingerprint sensor module, and reduce the difficulty of wiring

Method used

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  • Fingerprint sensor module and manufacturing method thereof
  • Fingerprint sensor module and manufacturing method thereof
  • Fingerprint sensor module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] figure 1 It is a schematic structural diagram of the fingerprint sensor module provided by Embodiment 1 of the present invention. The fingerprint sensor module provided by the embodiment of the present invention can be applied to electronic devices such as attendance machines, access control devices, and mobile phone terminals.

[0046] Such as figure 1 As shown, the fingerprint sensor module provided in this embodiment includes:

[0047] Fingerprint sensing chip 110 and at least one auxiliary chip 120, wherein, fingerprint sensing chip 110 and at least one auxiliary chip 120 are packaged into a chip package 100 by plastic packaging material 101, and the fingerprint sensing chip 110 and at least one auxiliary chip The circuit faces of 120 face the same direction, and the back surface of the above-mentioned chip package 100 is formed with a rewiring pattern electrically connected to the pad of the fingerprint sensor chip 110 and the pad of at least one auxiliary chip 1...

Embodiment 2

[0053] figure 2 It is a schematic structural diagram of a fingerprint sensor module provided by Embodiment 2 of the present invention. Such as figure 2As shown, further, in the fingerprint sensor module provided in this embodiment, the plastic sealing material 101 at least partially covers the working surface 111 of the fingerprint sensor 110 .

[0054] Optionally, the front surface of the chip package 100 is further provided with a color coating 130 and / or a wear-resistant coating 140 .

[0055] The color coating 130 can be used to match the color of the panel of the mobile phone, and the wear-resistant coating 140 can prevent the mobile phone from repeatedly touching the working surface 111 of the fingerprint sensor chip 110 to cause scratches. In particular, the color coating 130 and the wear-resistant coating 140 can be a separate two-layer structure, or the same layer structure, that is, there is only one layer of color coating 130, wherein the color coating 130 has a...

Embodiment 3

[0061] Figure 4 It is a schematic structural diagram of the fingerprint sensor module provided by the third embodiment of the present invention. Such as Figure 4 As shown, further, the fingerprint sensor module provided in this embodiment also includes a rigid-flex board 170 , wherein the rigid-flex board 170 includes a conductive circuit layer, and a plurality of solder joints arranged on the front surface of the rigid-flex board 170 The multiple pads are respectively electrically connected to the multiple bumps 102 on the redistribution pattern on the back of the chip package 100 .

[0062] Rigid-flex boards, that is, flexible circuit boards (FPC) and rigid circuit boards (PCB), are combined according to relevant process requirements after lamination and other processes to form circuit boards with FPC characteristics and PCB characteristics. The fingerprint sensor module provided by the third embodiment of the present invention is attached to the rigid-flex board 160. Th...

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PUM

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Abstract

The embodiment of the invention discloses a fingerprint sensor module. The fingerprint sensor module comprises a fingerprint sensing chip and at least an auxiliary chip; the fingerprint sensing chip and the at least one auxiliary chip are packaged into a chip package by a plastic packaging material; the circuit surfaces of the fingerprint sensing chip and the at least one auxiliary chip point towards the same direction; a rewiring pattern electrically connected with a welding pad of the fingerprint sensing chip and a welding pad of the at least one auxiliary chip is formed at the backside of the chip package; and multiple convex points are formed at the rewiring pattern. According to the fingerprint sensor module, the reliability of the fingerprint sensor module is improved, and the wiring difficulty is reduced.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a fingerprint sensor module and a manufacturing method thereof. Background technique [0002] The fingerprint sensor chip is the key device to realize fingerprint collection. After the fingerprint sensor chip is manufactured, a series of packaging processes are first performed on the fingerprint sensor chip, and then a limit ring is installed to form a fingerprint sensor module. Fingerprint sensor modules are mainly used in electronic equipment such as attendance machines, access control devices and mobile terminals. [0003] The existing fingerprint sensor chip packaging method is as follows: deep reactive etching or other processes are used to form deep grooves on the fingerprint sensor chip, and then the connection pad is placed in the deep groove through physical or chemical rewiring process, and then through Wire bonding connects the fingerprint sensor chip to the carrier substrate....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L27/146
CPCH01L25/16H01L27/14636H01L27/1469
Inventor 朱文辉吕军王邦旭赖芳奇
Owner 苏州科阳半导体有限公司