Silicon wafer polishing machine edge guide wheel
A silicon wafer polishing and guide wheel technology, which is applied in the direction of grinding machine tools, grinding devices, metal processing equipment, etc., can solve the problems of affecting the normal operation of equipment, high probability of screw breakage, short life of edge guide wheels, etc., and achieves easy disassembly and maintenance , good stability, and the effect of improving work efficiency
Inactive Publication Date: 2017-01-04
GRINM SEMICONDUCTOR MATERIALS CO LTD
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Under the existing edge guide wheel structure, the connection between the central shaft and the fixed connecting arm is not easy to disassemble, and the upper and lower covers are fastened by screws, which has a high probability of screw breakage, resulting in a short overall life of the edge guide wheel and affecting the normal operation of the equipment
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] The present invention will be further described below in conjunction with the accompanying drawings, but it does not mean limiting the protection scope of the present invention.
[0017] Such as figure 1 , 2 As shown, the edge guide wheel of the silicon wafer polishing machine of the present invention includes a rotating assembly and an outer ring 1, and the rotating assembly includes an upper cover 2, a lower cover 3, a central shaft 4, a bearing 5 and a bearing outer casing 6; wherein,
[0018] Two bearings 5 are installed on the central shaft 4 through transition fit, and the outer edges of the two bearings 5 are sleeved in the bearing outer shell 6 through transition fit; the upper cover 2 is located on the upper part of the bearing outer shell 6, and its upper edge has a protrusion 7 The lower cover 3 is located at the lower part of the bearing outer cover 6, and its lower edge has a protrusion 8; Interlocking of platform structures. The upper cover and the ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a silicon wafer polishing machine edge guide wheel. The guide wheel is fixedly connected onto a base of a silicon wafer polishing machine through a connecting arm, and comprises a rotating assembly and an outer ring, wherein the rotating assembly comprises an upper cover, a lower cover, an intermediate shaft, bearings and a bearing outer race; two bearings are mounted on the intermediate shaft in a transition fit manner, and outer edges of the two bearings are arranged in the bearing outer race in a sleeved manner through transition fit; the upper cover is positioned on the upper part of the bearing outer race, and a bulge is formed in the upper edge of the upper cover; the lower cover is positioned on the lower part of the bearing outer race, and a bulge is formed in the lower edge of the lower cover; the upper cover, the bearing outer race and the lower cover are fixedly connected through screws, and the bearing outer race is mutually meshed with the lower cover through a concave-convex staggered structure; the outer ring is mounted outside the rotating assembly; grooves are respectively formed in the upper end and the lower end of the outer ring; the groove in the upper end is clamped with the bulge in the upper edge of the upper cover; and the groove in the lower end is clamped with the bulge in the lower edge of the lower cover. The silicon wafer polishing machine edge guide wheel disclosed by the invention is capable of realizing stable rotation of a ceramic plate in the silicon wafer polishing process and is high in stability and long in service life.
Description
technical field [0001] The invention relates to an edge guide wheel of a silicon wafer polishing machine, which belongs to the technical field of silicon wafer polishing. Background technique [0002] The edge guide wheel of semiconductor silicon material polishing machine has two main functions. One is to assist in positioning the position of the ceramic plate, so that the polishing head can be accurately aligned with the ceramic plate when the polishing head is pressed down. To support the ceramic plate, the auxiliary ceramic plate rotates. During the polishing process, the edge guide wheel supports the ceramic plate from the side, and rotates with the rotation of the ceramic plate, which plays the role of positioning and auxiliary rotation. The pressing pressure of the polishing head is 300kg / cm 2 , so during the rotation of the polishing head, the edge guide wheel bears lateral force. Under the existing edge guide wheel structure, the connection between the central sha...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/34
CPCB24B37/34
Inventor 孙超刘建涛赵晶叶林
Owner GRINM SEMICONDUCTOR MATERIALS CO LTD