Cutting device
A cutting device and tape cutting technology, which is applied to fine working devices, stone processing tools, working accessories, etc., can solve the problems of troublesome adjustment, imperfect segmentation, damage to the surface of the substrate, etc., and achieve reliable and effective segmentation.
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[0030] Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings. The semiconductor substrate W to be processed in this embodiment is mainly a semiconductor substrate for image sensors, and its form is similar to that described previously. figure 1 The semiconductor substrates shown are the same. Below, right figure 1 The cutting of the semiconductor substrate W in (c) will be described.
[0031] figure 2 It is an explanatory view showing the cutting mechanism part of the cutting device A of the present invention, and has a table 4 on which the semiconductor substrate W is placed together with the cutting frame 1. A space 5 is provided in the middle of the table 4, and a pair of left and right passive knives 6 and 6 are arranged in this space 5. The gap 6a formed between the passive knives 6, 6 is figure 2 It extends in the front-rear direction (X direction), and a long plate-shaped cutting strip 7 extending in the X directio...
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