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LED lamp strip panel and manufacturing method thereof

A technology of LED light bar and manufacturing method, which is applied in the field of LED lighting, can solve the problems of loss of light efficiency and reflectivity cannot exceed 90%, and achieve the effects of improving efficiency, reducing loss of light energy, and improving insulation performance

Active Publication Date: 2017-01-04
深圳市鼎华芯泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the existing technical conditions, even the solder resist ink with the highest reflectivity cannot exceed 90%. Therefore, during use, due to the absorption of the solder resist material, the light energy irradiated on the solder resist surface will be at least 10%. % loss of light efficacy

Method used

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  • LED lamp strip panel and manufacturing method thereof
  • LED lamp strip panel and manufacturing method thereof
  • LED lamp strip panel and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A LED light strip, such as Figure 1-3 , 7, including: a bendable metal substrate, an adhesive layer, and a circuit layer; the bendable metal substrate has opposite first and second surfaces, and the first surface has a first high-reflectivity coating; The glue layer is covered on the first high-reflectivity coating; the circuit layer is covered on the glue layer, and the surface of the circuit layer has a second high-reflectivity coating; the circuit layer, the glue layer and the The bent metal substrates are laminated to form a bendable structure.

[0044] Wherein, the metal substrate can reflect light so as to obtain good light effect. Therefore, the reflective layer needs to use materials with high reflectivity in order to obtain the above-mentioned effects, such as mirror silver and mirror aluminum. Special attention should be paid to the fact that the side with high reflectivity on the reflective layer is bonded to the circuit layer through the adhesive layer. ...

Embodiment 2

[0050] A LED light strip, such as Figure 1-3 , 6, including: a bendable metal substrate, an adhesive layer, and a circuit layer; the bendable metal substrate has opposite first and second surfaces, and the first and second surfaces are coated with the first A high-reflectivity coating; the adhesive layer is coated on the first high-reflectivity coating on the two surfaces; the circuit layer is coated on the adhesive layer, and the surface of the circuit layer has a second high-reflectivity coating; the The circuit layer, glue layer and bendable metal substrate are laminated to form a bendable structure.

[0051] Wherein, the metal substrate can reflect light so as to obtain good light effect. Therefore, the reflective layer needs to use materials with high reflectivity in order to obtain the above-mentioned effects, such as mirror silver and mirror aluminum. Special attention should be paid to the fact that the side with high reflectivity on the reflective layer is bonded t...

Embodiment 3

[0057] The present invention also proposes a method for manufacturing LED lamp strips, such as Figure 1-2 The described method shown in , 4,5,7 comprises the steps:

[0058] Step 1, forming a bendable metal substrate, and forming a high-reflectivity coating on one side of the bendable metal substrate.

[0059] The metal substrate can reflect the light so as to obtain good light effect. Therefore, the reflective layer needs to use materials with high reflectivity in order to obtain the above-mentioned effects, such as mirror silver and mirror aluminum. Special attention should be paid to the fact that the side with high reflectivity on the reflective layer is bonded to the circuit layer through the adhesive layer. In order to obtain better light efficiency, a metal substrate with high reflectivity on both sides can also be used.

[0060] Step 2, forming an adhesive layer on the high-reflectivity coating.

[0061] For the adhesive layer, materials with low light absorption ...

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Abstract

The invention discloses an LED lamp strip panel and a manufacturing method thereof. The lamp strip panel comprises a bendable metal substrate, an adhesive layer, and a circuit layer and high-reflectivity plating layers are arranged on the circuit layer and the metal substrate; and the circuit layer, the adhesive layer and the bendable metal substrate layer are laminated to form a bendable structure. The end area of the LED lamp strip panel is bent by 180 degrees in the direction of the bendable metal substrate; and the bent part of the metal substrate is overlapped on the non-bent part of the metal substrate. The LED lamp strip panel can reduce the light absorption loss, greatly improves the light emitting efficiency, inhibits the creepage effect, prolongs the service life, and is safe and reliable.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a light strip and a manufacturing method thereof. Background technique [0002] LED light strips have very important applications in the prior art, which are usually a strip circuit formed by connecting multiple LEDs together. In the light strips in the prior art, the surface of the circuit is covered with solder resist. In order to enhance the light effect, solder resist ink with high reflectivity is selected. Under the existing technical conditions, even the solder resist ink with the highest reflectivity cannot exceed 90%. Therefore, during use, due to the absorption of the solder resist material, the light energy irradiated on the solder resist surface will be at least 10%. % loss of light efficacy. Contents of the invention [0003] The applicant found in the process of research and use that in addition to the light energy loss caused by the absorption of the solder resist in...

Claims

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Application Information

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IPC IPC(8): F21K9/20F21K9/90F21Y115/10
CPCF21K9/90
Inventor 何忠亮朱争鸣孙凯吴金水
Owner 深圳市鼎华芯泰科技有限公司
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