Power semiconductor module and thermal fatigue life determination method for the same

Abstract

The invention discloses a power semiconductor module and a thermal fatigue life determination method for the same. The power semiconductor is arranged inside the housing; a plurality of power semiconductor members are bonded with an insulation substrate through welding; and the insulation substrate is bonded with a base through welding. The power semiconductor module comprises a thermal fatigue life determination member; the thermal fatigue life determination member is formed on a surface side of the housing and has following color aging characteristics: the color of the thermal fatigue life determination member which is presented under prescribed temperature is changed along the increase of temperature circulation times that the power semiconductor module experiences and is finally aged to a prescribed fully aging color. The thermal fatigue life determination member determines the thermal fatigue life of the power semiconductor module according to the color of the thermal fatigue life determination member which is presented in the prescribed temperature.

Description

technical field [0001] The present invention relates to a power semiconductor module, in particular to a power semiconductor module including power semiconductor elements such as IGBT (Insulated Gate Bipolar Transistor) for high power conversion, and a thermal fatigue life determination method of the power semiconductor module. Background technique [0002] In recent years, power semiconductor modules have been used not only in high-power fields represented by power generation and power supply, but also in wider fields such as household appliances, railways, electric vehicles, and fuel cell power generation systems. Under the above circumstances, the power semiconductor module will have a great impact on the quality and reliability of each application, so the power semiconductor module is required to have high reliability. [0003] The temperature of the power semiconductor module rises and falls according to the temperature change in the operating environment. The internal...

AI Technical Summary

Problems solved by technology

During the operation of the power conversion device, when the power semiconductor module reaches its thermal fatigue life, it will cause the power conversion device to stop abnormally, and may cause the production line to stop

However, it takes a long time to find out the cause of the stop and repair it, so it may cause a large economic loss

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