Process abnormality diagnosis system and method

Abstract

The invention discloses a process abnormality diagnosis system. The process abnormality diagnosis system comprises a corresponding relation generation module, a test result analysis module, a process analysis module and an abnormality step determination module, wherein the corresponding relation generation module generates at least one corresponding relation table according to post-stage test abnormality data of a historical batch and a process abnormality step of the historical batch, the test result analysis module comprises a corresponding relation query unit, the corresponding relation query unit inquires the corresponding relation table according to the post-stage test abnormality data of a current batch to find out a suspicious process abnormality step of the current batch, the process analysis module inquires information of the suspicious process abnormality step of the current batch in a storage database, and the abnormality step determination module determines the abnormality step of the current batch in a process according to the information. The invention also discloses a process abnormality diagnosis method. With the process abnormality diagnosis system and method provided by the invention, the abnormality step of the current batch in the process can be rapidly and accurately diagnosed according to the post-stage test abnormality data of the current batch.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a system and method for diagnosing process abnormalities. Background technique [0002] After the semiconductor wafer (Wafer) completes all the manufacturing processes, the electrical test for various test structures on the wafer is called WAT (Wafer Acceptance Test, electrical qualification test). Through the analysis of WAT data, we can find problems in the process of semiconductor wafers and help the process to adjust. Therefore, before the wafer manufacturing is completed and the Fab (semiconductor manufacturing plant) is released, the wafer needs to be tested for WAT. Taking an 8-inch wafer as an example, generally 5 points are tested for each wafer. If the test value of one point exceeds the specified range, the site (point) is considered invalid. [0003] At present, there are already many different methods of control for different parameter character...

AI Technical Summary

Problems solved by technology

However, engineers need to switch systems frequently and select data repeatedly, which takes a lot of time and effort

If similar problems have occurred for a long time, due to personnel changes and other reasons, the engineers who have dealt with similar problems may no longer be in Fab, then the previous experience may be lost, thus further prolonging the time to determine the problem

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