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Heat dissipation equipment of TR module

A technology of a heat sink and a heat sink, which is applied in the field of communication, can solve the problems of insignificant effect of the metal shell, and achieve the effect of sufficient heat dissipation

Inactive Publication Date: 2017-01-11
CHENGDU RUIXIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most transceiver modules are miniaturized and densely packaged, and the effect of relying solely on metal shells for heat dissipation is not significant

Method used

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  • Heat dissipation equipment of TR module

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Embodiment Construction

[0007] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0008] see figure 1 , is a schematic structural diagram of a heat dissipation device of a TR module according to an embodiment of the present invention. The heat dissipation device of the TR module in this embodiment includes a radiator 1 and a radiator plate 2. The upper part of the radiator 1 is provided with a row of rectangular grooves 11 in the vertical direction, and the middle and lower parts of the radiator 1 are provided with a row of rectangular groo...

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Abstract

The invention provides heat dissipation equipment of a TR module. The heat dissipation equipment comprises a radiator and a heat dissipation plate; a column of rectangular grooves are vertically formed in the upper portion of the radiator, and a column of horizontal rectangular grooves are formed in the middle and the lower portion of the radiator; the upper end of the heat dissipation plate is connected with the lower end of the radiator; the heat dissipation plate comprises a heat sink directly and closely making contact with the lower end of the radiator and heat dissipation fins, wherein heat transfer copper pipes transferring heat to the heat dissipation fins are arranged on the heat sink; and the upper end of the radiator is used for being embedded in the TR module at least partly. The heat dissipation equipment of the TR module can conduct full heat dissipation through the mode.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a heat dissipation device for a TR module. Background technique [0002] The transceiver module is generally installed and thermally contacted on the metal casing, and uses the thermal conductivity of the metal casing to dissipate heat without a special heat dissipation device. However, most transceiver modules are miniaturized and densely packaged, and the effect of relying solely on metal shells for heat dissipation is not significant. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a heat dissipation device for a TR module, which can fully dissipate heat. [0004] In order to solve the above technical problems, a technical solution adopted by the present invention is to provide a heat dissipation device for a TR module, including a heat sink and a heat dissipation plate, the upper part of the heat sink is ...

Claims

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Application Information

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IPC IPC(8): F28D1/03F28D1/053F28F3/04
CPCF28D1/03F28D1/053F28F3/04
Inventor 邱义杰廖云龙周载理李云飞王明清
Owner CHENGDU RUIXIN TECH