PCB thin board vertical flying probe test bracing frame
A flying probe test and support frame technology, which is applied to the casing of the measuring device, etc., can solve the problems that the product quality cannot be accurately judged, the PCB board cannot be accurately tested, and the inter-connectivity cannot be measured, and the efficiency of the flying probe test can be improved. , Improve the reliability of measurement and the effect of eliminating shaking
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2017-01-18
- Estimated Expiration
- Not applicable · inactive patent
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Figure 1
Abstract
Description
technical field
[0001] The invention relates to the field of industrial automation, in particular to a PCB sheet vertical flying probe test support frame. Background technique
[0002] The existing vertical flying probe testing machine can only test PCB boards with a certain thickness and rigidity, and cannot accurately test PCB boards that are relatively thin and soft, thin and easy to fold, or the measuring point is close to the edge of the board, and the direct measurement is caused by the shaking of the PCB board. Or poor fixture splints will lead to missing tests and false test points. Only one-sided measurement can make the conductivity between the layer hole walls impossible to measure and inefficient, and it is impossible to make accurate judgments on product quality. Contents of the invention
[0003] The technical problem mainly solved by the present invention is to provide a PCB sheet vertical flying probe test support frame.
[0004] The technical scheme that ...
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Embodiment Construction
[0020] The present invention will be further elaborated below in conjunction with accompanying drawing, please refer to figure 1 .
[0021] A kind of PCB sheet vertical flying probe test support frame, it is characterized in that: comprise support frame body 1, described support frame body is located on PCB board surface, is provided with for probe to pass through support frame body and The through hole 2 contacted by the pad or via hole on the PCB; the number of the through hole is the same as the total number of the pad and the via on the PCB; the length of the through hole is greater than the length of the through hole, and the length of the through hole The width is greater than the width of the through hole; the material of the support frame body is FR-4 insulating material.
[0022] The manufacturing method of support frame body of the present invention is:
[0023] a. Measure the PCB size to obtain the length and width data of the PCB; then take the entire FR-4 insula...