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Automatic-regulating type hot-pressing head structure suitable for flip chip die bonding

A technology of automatic adjustment and thermal pressure head, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc. The effect of rate difference

Inactive Publication Date: 2017-01-25
GUANGDONG DELI PHOTOELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides an automatically adjustable thermal head structure suitable for flip-chip bonding, which overcomes the shortcomings of high parallelism requirements and poor yield when the existing thermal head is attached, and realizes high-precision thermal processing under general processing accuracy conditions. Indenter manufacturing, suitable for mass production

Method used

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  • Automatic-regulating type hot-pressing head structure suitable for flip chip die bonding
  • Automatic-regulating type hot-pressing head structure suitable for flip chip die bonding
  • Automatic-regulating type hot-pressing head structure suitable for flip chip die bonding

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Embodiment

[0017] Example: The self-adjusting type thermal head structure suitable for flip-chip bonding provided by this embodiment has a structure such as figure 1 As shown, it includes the main body 11 of the existing thermal head and the elastic film 12 coated on its surface. The elastic film is made of a high-temperature-resistant high-elastic alloy and meets the following indicators: 1) The elastic modulus E is lower than 200GPa, The elastic modulus is used to reflect the elasticity of a material. If the elastic modulus is low, the elasticity is better; 2) The compressive strength is higher than 0.2GPa, and the high compressive strength can prevent the metal properties of the elastic film from being destroyed when the pressure exceeds the compressive strength. ; 3) The thickness is between 100um~10cm, and it has good elastic properties at 300K~1000K.

[0018] Highly elastic alloys and constant elastic alloys are the two main classes of elastic alloys. Due to the stress and strai...

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Abstract

The invention provides an automatic-regulating type hot-pressing head structure suitable for flip chip die bonding. The automatic-regulating type hot-pressing head structure comprises a hot-pressing head arranged on a laminating machine and is characterized in that an elastic film produced by high-elasticity alloy materials coats the surface of the hot-pressing head, the elasticity modulus E of the elastic film is lower than 200GPa, the compressive strength of the elastic film is higher than 0.2GPa, and the thickness of the elastic film ranges from 100 micrometers to 10cm. The invention further discloses flip chip laminating machine integrating electricity, machinery, light and image and using the hot-pressing head. The automatic-regulating type hot-pressing head structure has the advantages that the defects that an existing hot-pressing head is high in parallelism requirement and poor in yield during chip surface mounting are overcome, high-precision hot-pressing head manufacturing under a common machining precision condition is achieved, the surface of the elastic film of the hot-pressure head can always attach to the surface of a workpiece during use, the position of the workpiece can be adjusted according to the flatness of the workpiece, product quality is guaranteed, and the automatic-regulating type hot-pressing head structure is suitable for batch production due to the fact that the parallelism requirements are lowered.

Description

technical field [0001] The invention relates to an indenter structure of a pressing machine, in particular to an automatic adjustment type thermal indenter structure suitable for flip chip bonding. Background technique [0002] Products that are hot-pressed by a hot press, especially flip-chip hot-pressing, require uniform force on the pressing surface, that is, good parallelism between the hot-press head, the flip-chip and the substrate, in order to ensure the quality of the product. At present, the surface of the hot press head produced by various manufacturers in the market is rigid, and the parallelism between it and the workpiece depends on the processing accuracy of the jig or by adjusting the jig, but in fact the accuracy of the jig is at a high level. There are also some errors, and the way of adjusting the fixture is more time-consuming, resulting in low production efficiency. In addition, the uniformity of raw materials will also affect the hot pressing results. F...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/603
CPCH01L24/76H01L2224/7655H01L2224/16
Inventor 刘洋叶国光罗长得郝锐
Owner GUANGDONG DELI PHOTOELECTRIC
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