Method for improving thermal conductivity of viscous medium based on warm-hot forming of viscous medium

A viscous medium, warm forming technology, applied in the field of improving the thermal conductivity of viscous medium, can solve the problems of reduced plate production efficiency, long heating preparation time of viscous medium, low thermal conductivity of viscous medium, etc., to shorten the heating preparation time and improve production efficiency Improved, high thermal conductivity effect

Active Publication Date: 2017-02-01
SHENYANG AEROSPACE UNIVERSITY
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AI Technical Summary

Problems solved by technology

[0003] However, the thermal conductivity of the currently used viscous medium is low, and the viscous medium needs a long heating preparation time before the plate forming is officially started, which will inevitably reduce the production efficiency of the plate

Method used

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  • Method for improving thermal conductivity of viscous medium based on warm-hot forming of viscous medium

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] A method for improving the thermal conductivity of a viscous medium based on warm forming of the viscous medium, comprising the steps of:

[0022] Step 1: Prepare a particle with a higher thermal conductivity than the viscous medium, and set the particle size value of the particle and the mass percentage of the particle to the viscous medium; the value range of the particle size is nanometer, micron or Millimeter level, the range of the mass percentage of particulate matter and viscous medium is 10% to 50%;

[0023] Step 2: Prepare a transparent container and put the viscous medium into the measuring cup;

[0024] Step 3: Add the particles into the measuring cup filled with viscous medium;

[0025] Step 4: Evenly mix the particles in the measuring cup with the viscous medium;

[0026] Step 5: Send the measuring cup containin...

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Abstract

The invention provides a method for improving the thermal conductivity of a viscous medium based on warm-hot forming of the viscous medium. The method comprises the steps that particulate matter with the thermal conductivity being higher than that of the viscous medium is prepared, and the particle size value and the mass percent of the particulate matter are set; the particulate matter and the viscous medium are mixed evenly in a transparent container and then heated, specifically, the heating temperature is set according to the practical forming temperature of a plate; the setting or floating condition of the particulate matter is observed, the setting or floating distance of the particulate matter is recorded every other one hour, and the setting or floating speed is worked out; when the setting or floating speed is larger than 5 mm / h, the particle size value of the particulate matter is reset; when the setting or floating speed is smaller than 5 mm / h, the thermal conductivity is measured; if the thermal conductivity is improved by less than two times, the mass percent of the particulate matter is increased, and when the mass percent of the particulate matter is 50%, if the thermal conductivity is improved still by less than two times, the particle size value of the particulate matter is reset; and when the thermal conductivity is improved by more than two times, the particulate matter can be used for improving the thermal conductivity of the viscous medium.

Description

technical field [0001] The invention belongs to the technical field of viscous medium thermoforming, in particular to a method for improving the thermal conductivity of viscous medium based on viscous medium thermoforming. Background technique [0002] For viscous medium thermoforming technology, it can use the properties of the viscous medium at a certain temperature to improve the deformation ability and forming quality of the sheet (metal sheet, resin sheet and composite sheet). In the sheet forming process, not only the viscosity is required The medium should have good heat resistance and thermal stability to meet the forming temperature required by the sheet, and the viscous medium should have good thermal conductivity to meet the requirement that the sheet reach the forming temperature in a short period of time and realize the internal temperature of the sheet. Evenly distributed. [0003] However, the thermal conductivity of the currently used viscous medium is low, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D26/021
CPCB21D26/021
Inventor 高铁军刘青吕阳杰
Owner SHENYANG AEROSPACE UNIVERSITY
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