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A kind of manufacturing method of high tg lead-free low dielectric copper clad laminate

A technology for copper clad laminates and manufacturing methods, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve the problems of short resistance to layering, low peel strength, poor processing performance, etc. Large, good flame retardant effect, heat resistance and high chemical resistance effect

Active Publication Date: 2018-09-25
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned patent discloses a halogen-free system. Halogen-free and lead-free are two different systems. The relative cost of the halogen-free system is relatively high, and the delamination resistance time is slightly short; and the processability is poor, and the peel strength is low. The present application It is the improved technical solution proposed to overcome the above technical problems, further improving the delamination resistance time

Method used

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  • A kind of manufacturing method of high tg lead-free low dielectric copper clad laminate
  • A kind of manufacturing method of high tg lead-free low dielectric copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0043] The main raw materials for preparing high Tg lead-free low dielectric copper clad laminates are brominated modified epoxy resin, isocyanate modified epoxy resin, polymeric anhydride curing agent, 2-ethyl-4 methylimidazole, spherical Composed of silica, organic solvent and toughening agent.

[0044] table 3

[0045] material name

Example 1

Example 2

Example 3

Brominated epoxy resin (%)

16.7

15.36

14.71

Isocyanate modified epoxy resin (%)

12.6

13.4

14.3

Modified polymeric anhydride curing agent (%)

24.6

22.5

20.4

2-Ethyl-4 methylimidazole (%)

0.01

0.01

0.01

Spherical silica (%)

21.8

24.5

27.4

Silane (%)

0.11

0.12

0.14

Organic solvents(%)

20.6

21.6

20.28

Toughener (%)

3.58

3.51

3.38

[0046]1. The specific preparation process is as follows:

[0047] A. Add organic solvent and silane in the mixing ...

Embodiment 4

[0069] A method for manufacturing a high-Tg lead-free and low-dielectric copper-clad laminate adopts the following steps:

[0070] (1) gluing to make a prepreg;

[0071] (1-1) Circulate the adhesive to the gluing machine, control the line speed of the gluing machine to 6m / min, and evenly coat the adhesive on the E-grade glass with a specification of 101 after pre-soaking and main immersion on fiber cloth;

[0072] (1-2) The glass fiber cloth coated with the adhesive is baked in a 120°C oven to volatilize the solvent, and the adhesive is initially reacted and solidified to obtain a prepreg;

[0073] (2) typesetting and pressing;

[0074] Cut the prepregs into the same size, 18 sheets in a group, and then stack them with 1 / 3oz copper foil. The control pressure is 80psi, the temperature of the hot plate is 60°C, the vacuum degree is -0.03Mpa, the pressing time is 90min, and the curing time is: 60min, pressed and solidified to obtain a copper clad board.

[0075] The adhesive ...

Embodiment 5

[0084] A method for manufacturing a high-Tg lead-free and low-dielectric copper-clad laminate adopts the following steps:

[0085] (1) gluing to make a prepreg;

[0086] (1-1) Circulate the adhesive to the gluing machine, control the line speed of the gluing machine to 10m / min, and apply the adhesive evenly on the E-grade glass with a specification of 104 after pre-soaking and main immersion on fiber cloth;

[0087] (1-2) The glass fiber cloth coated with the adhesive is baked in a 200°C oven to volatilize the solvent, and the adhesive is initially reacted and solidified to obtain a prepreg;

[0088] (2) typesetting and pressing;

[0089] Cut the prepregs into the same size, 10 sheets in a group, and then laminated with RTF copper foil, then pressed and cured, the control pressure is 300psi, the temperature of the hot plate is 100°C, the vacuum degree is 0.05Mpa, the pressing time is 120min, and the curing time is 120 minutes. Time: 120min to get the copper clad board.

[...

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Abstract

The invention relates to a manufacturing method of a high-Tg lead-free low-dielectric copper-foil-coated board. The method comprises the following steps: circulating an adhesive onto an adhesive applicator, and carrying out preimpregnation and primary impregnation to uniformly coat the adhesive onto glass cloth; drying the adhesive-coated glass cloth in a 120-250-DEG C drying box to volatilize the solvent and preliminarily cure the adhesive by reaction, thereby obtaining a prepreg; and dividing the prepreg into multiple groups (1-18 pieces with the same size in each group), laminating with copper foil, pressing and curing to obtain the copper-foil-coated board. Compared with the prior art, the copper-foil-coated board has low water absorptivity and favorable machinability; the flame retardancy reaches UL94V-0; and the copper-foil-coated board can completely satisfy the demands for the lead-free preparation procedure and multilayer board production in the field of high-frequency high-speed PCBs (printed circuit boards).

Description

technical field [0001] The invention relates to the field of preparation of copper-clad boards, in particular to a method for manufacturing high-Tg lead-free and low-dielectric copper-clad boards. Background technique [0002] The 21st century has entered a highly informationized society. Computers, mobile communications, and networks have gradually penetrated into every corner of society and people's lives. Human life is steadily developing in the direction of high informationization. Information processing and information communication constitute Two technical pillars in the development of highly informationized science and technology. In order to meet the ultra-large-capacity information transmission brought about by the rapid development of information technology, as well as the rigid requirements of ultra-fast and ultra-high-density information processing, higher requirements are put forward for printed circuit boards and copper-clad laminates. The specific requirements...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/12C08L63/00C08K5/3445C08K7/18C08K3/36
CPCB32B37/10B32B37/12B32B37/1284B32B2037/1269B32B2307/3065B32B2307/726C08L63/00C08L2203/20C08L2205/025C08K5/3445C08K7/18C08K3/36
Inventor 密亚男粟俊华张东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD