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Adhesive for high-Tg, lead-free and low-dielectric type copper-clad plate and preparation method thereof

A copper-clad laminate and adhesive technology, which is applied in the direction of non-polymer adhesive additives, adhesive types, adhesives, etc., can solve the problems of short delamination resistance time, low peel strength, and poor processability. Achieve the effects of large compounding amount, good flame retardant effect, heat resistance and high chemical stability

Inactive Publication Date: 2017-02-08
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned patent discloses a halogen-free system. Halogen-free and lead-free are two different systems. The relative cost of the halogen-free system is relatively high, and the delamination resistance time is slightly short; and the processability is poor, and the peel strength is low. The present application It is the improved technical solution proposed to overcome the above technical problems, further improving the delamination resistance time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0036] The main raw materials for preparing high Tg lead-free low dielectric copper clad laminates are brominated modified epoxy resin, isocyanate modified epoxy resin, polymeric anhydride curing agent, 2-ethyl-4 methylimidazole, spherical Composed of silica, organic solvent and toughening agent.

[0037] table 3

[0038] material name Example 1 Example 2 Example 3 Brominated epoxy resin (%) 16.7 15.36 14.71 Isocyanate modified epoxy resin (%) 12.6 13.4 14.3 Modified polymeric anhydride curing agent (%) 24.6 22.5 20.4 2-Ethyl-4 methylimidazole (%) 0.01 0.01 0.01 Spherical silica (%) 21.8 24.5 27.4 Silane (%) 0.11 0.12 0.14 Organic solvents(%) 20.6 21.6 20.28 Toughener (%) 3.58 3.51 3.38

[0039] 1. The specific preparation process is as follows:

[0040] A. Add organic solvent and silane in the mixing tank in turn according to the formula amount, turn on the high-speed stirrer at a speed of 15...

Embodiment 4

[0044] An adhesive suitable for high-Tg lead-free low-dielectric copper-clad laminates adopts the following components and contents in parts by weight: brominated modified epoxy resin 10, isocyanate-modified epoxy resin 5, modified Polymeric anhydride 20, 2-ethyl-4 methylimidazole 0.005, spherical silica 10.0, silane 0.10, toughening agent 1.00, organic solvent 10.0.

[0045] Among them, the brominated modified epoxy resin used is brominated bisphenol A type epoxy resin, the isocyanate modified epoxy resin is aromatic diphenylmethane diisocyanate modified epoxy resin, modified polymerization The acid anhydride is EF-30 resin produced by Sartomer Company. The average particle size of the spherical silica is 0.5 μm, the maximum particle size is not more than 24 μm, and the purity is above 99.0 wt%. The silane is γ-aminopropyltriethoxysilane, and the toughening agent is FORTEGRA 351 resin produced by American Dow Chemical.

[0046] An adhesive suitable for Tg lead-free low-dielect...

Embodiment 5

[0053] An adhesive suitable for high-Tg lead-free low-dielectric copper-clad laminates, comprising the following components and contents in parts by weight: brominated modified epoxy resin 50, isocyanate-modified epoxy resin 40, modified Polymeric anhydride 40, 2-ethyl-4 methylimidazole 0.01, spherical silica 50.0, silane 0.15, toughening agent 5.0, organic solvent 40.0.

[0054] Among them, the brominated modified epoxy resin is brominated phenolic epoxy resin, the isocyanate modified epoxy resin is toluene diisocyanate modified epoxy resin, and the modified polymeric anhydride is 8005H produced by American Dow Chemical Co., Ltd. The resin has an average particle size of spherical silica of 0.5 μm, a maximum particle size of no more than 24 μm, and a purity of more than 99.0 wt%. The silane is a mixture of γ-aminopropyltrimethoxysilane and anilinomethyltrimethoxysilane, and the toughening agent is a mixture of FORTEGRA 351 resin produced by Dow Chemical in the United States a...

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Abstract

The invention relates to an adhesive for a high-Tg, lead-free and low-dielectric type copper-clad plate and a preparation method thereof. The adhesive comprises the following components in weight part: 10-80 parts of bromizated modified epoxy resin, 5-80 parts of isocyanate-modified epoxy resin, 20-70 parts of modified polymeric anhydride, 0.005-0.03 part of 2-ethyl-4-methylimidazole, 10.0-60.0 parts of spherical silica, 0.10-0.20 part of silane, 1.00-10.0 parts of flexibilizer, and 10.0-60.0 parts of organic solvent. Compared with the prior art, the adhesive is low in water absorption and excellent in mechanical machining property. Meanwhile, the flame-retardant property of the adhesive is up to the UL94V-O level. Therefore, the adhesive can completely meet the requirements of the lead-free process and the multilayer board production process in the high-frequency and high-speed PCB field.

Description

technical field [0001] The invention belongs to the field of copper clad laminate preparation, and in particular relates to an adhesive suitable for high Tg lead-free low dielectric copper clad laminate and a preparation method thereof. Background technique [0002] The 21st century has entered a highly informationized society. Computers, mobile communications, and networks have gradually penetrated into every corner of society and people's lives. Human life is steadily developing in the direction of high informationization. Information processing and information communication constitute Two technical pillars in the development of highly informationized science and technology. In order to meet the ultra-large-capacity information transmission brought about by the rapid development of information technology, as well as the rigid requirements of ultra-fast and ultra-high-density information processing, higher requirements are put forward for printed circuit boards and copper-c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C08G59/42C08G59/68
CPCC09J163/00C08G59/4246C08G59/686C08L2201/02C08L2201/08C08L2203/20C08L2205/025C09J11/04C09J11/06C08L63/00C08K7/18
Inventor 密亚男粟俊华张东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD