Hollow integrated circuit package

Abstract

The invention discloses a hollow integrated circuit package, which comprises a packaging device bottom unit, an integrated circuit packaging cover, a fixed buckle and a seal ring, wherein the packaging device bottom unit is located at the bottom of the hollow integrated circuit package; the integrated circuit packaging cover covers the packaging device bottom unit; the seal ring is arranged between the packaging device bottom unit and the integrated circuit packaging cover; the fixed buckle is located at two sides of the hollow integrated circuit package to tightly fix the packaging device bottom unit, the integrated circuit packaging cover and the seal ring; the packaging device bottom unit is made of a metal material; and metal radiating ribs are uniformly distributed at the lower part of the packaging device bottom unit. The hollow integrated circuit package disclosed by the invention can meet the packaging requirements of an integrated circuit board and also has heat dissipation performance, and the temperature of the integrated circuit package can be effectively reduced.

Description

[0001] Technical field: [0002] The invention relates to the technical field of integrated circuit packaging, in particular to a hollow integrated circuit packaging. [0003] Background technique: [0004] With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing in the direction of multi-function and miniaturization. In this way, the integration level of integrated circuits is required to be higher and higher, and the functions are more and more complex. Correspondingly, it is required that the packaging density of integrated circuits is increasing, the number of leads is increasing, the volume is getting smaller, the weight is getting lighter, and the replacement is getting faster and faster. The rationality and scientificity of the packaging structure will directly affect quality of integrated circuits. [0005] Considering that the operation of the integrated cir...

AI Technical Summary

Problems solved by technology

[0005] Considering that the operation of the integrated circuit will generate a lot of heat, if the heat in the integrated circuit package cannot be dissipated in time, the operating efficiency of the integrated circuit will be reduced, and in severe cases, the integrated circuit will fail

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