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Nozzle and substrate processing equipment including the nozzle

A technology for nozzles and substrates, which is applied in the direction of spraying devices, liquid spraying devices, and devices for coating liquid on the surface, etc., which can solve the problems of damaged cleaning, reduced cleaning efficiency, unevenness, etc.

Active Publication Date: 2020-05-12
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the pattern of the substrate is damaged and cleaning becomes uneven, thereby reducing cleaning efficiency

Method used

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  • Nozzle and substrate processing equipment including the nozzle
  • Nozzle and substrate processing equipment including the nozzle
  • Nozzle and substrate processing equipment including the nozzle

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0048]Hereinafter, exemplary embodiments of the present inventive concept will be described in detail with reference to the accompanying drawings. The embodiments of the present inventive concept can be modified in any form, and the scope of the present inventive concept should not be construed as being limited by the following embodiments. Embodiments of the inventive concept are provided so as to more fully describe the inventive concept to those skilled in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize clearer illustration.

[0049] In the following, reference will be made to Figure 1-Figure 16 Exemplary embodiments of the present inventive concept are described.

[0050] figure 1 It is a top view schematically showing the substrate processing system 1 .

[0051] see figure 1 , the substrate processing system 1 includes an index module 100 and a process module 200 . The indexing module 100 includes a plurality of load port...

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Abstract

A nozzle for supplying a fluid to a substrate, the nozzle including a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flow, wherein the body includes a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line, and a gas discharge hole that discharges the gas flowing through the gas discharge line.

Description

technical field [0001] The present inventive concept relates to a nozzle and a substrate processing apparatus including the nozzle, and more particularly to a two-fluid nozzle and a substrate processing apparatus including the same. Background technique [0002] Contaminants such as particles, organic contaminants, and metal contaminants on the substrate surface significantly affect the characteristics and yield of semiconductor devices. Thus, a cleaning process of removing various contaminants attached to the surface of the substrate is very important, and the process of cleaning the substrate is performed before or after a unit process for manufacturing a semiconductor. Generally, the process of cleaning the substrate includes: a chemical treatment process of removing metal substances, organic substances, and particles remaining on the substrate using a treatment liquid such as chemicals; a cleaning process of removing chemicals remaining on the substrate using pure water;...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02041H01L21/67051B05B7/061B05B7/10B05B7/06B05B7/0815B05C5/0208
Inventor 吴世勋崔基勋金袗圭
Owner SEMES CO LTD