Detachable integrated temperature changing testing Dewar and assembly thereof

Abstract

The invention provides a detachable integrated temperature changing testing Dewar including a temperature changing Dewar main body, the temperature changing Dewar main body includes a cold finger base, a housing, a cold finger cylinder, a cold plate and a performance test assembly, the lower end of the housing is connected with the cold finger base, the housing includes an upper part and a lower part that are detachably connected to form an enclosed space, the cold finger cylinder, the cold plate, and the performance test assembly are successively connected in the enclosed space from the bottom to the top, a vacuum valve is arranged on the housing, and meanwhile, the invention provides a detachable integrated temperature changing testing Dewar assembly. The detachable integrated temperature changing testing Dewar is in a live-vacuum and detachable integrated structure, chip installation and detachment are convenient, the structure is compact and small, and the testing efficiency is high; and moreover, the detachable integrated temperature changing testing Dewar assembly can meet the temperature testing requirements of an infrared detector chip and other low-temperature materials in the 55K-130K temperature range.

Description

technical field [0001] The invention belongs to the technical field of packaging of integrated dewar components, and in particular relates to a detachable integrated variable temperature test dewar and components thereof, which are suitable for low temperature variable temperature performance tests of infrared detector chips and other photoelectric materials. Background technique [0002] Before the infrared detector chip is formally packaged into a component, it needs to undergo a performance index test to screen out qualified chips, then package it into a Dewar, and couple it with a refrigerator to form an Integrated Detector Dewar Cooler Assembly (Integrated Detector Dewar Cooler Assembly). [0003] The performance index test of the chip before the official packaging is usually completed in the test Dewar. At present, there are mainly two types of test Dewar solutions for detector chips at home and abroad: (1) Liquid nitrogen test Dewar, the implementation method is First...

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Problems solved by technology

[0003] The performance index test of the chip before the official packaging is usually completed in the test Dewar. At present, there are mainly two types of test Dewar solutions for detector chips at home and abroad: (1) Liquid nitrogen test Dewar, the implementation method is First pump the Dewar to a vacuum state, and then inject liquid nitrogen into the Dewar to cool the chip to complete the test process. This method cannot achieve precise temperature control and cannot meet the test requirements of the chip at different temperatures; (2) An improved structure or system based on liquid nitrogen testing Dewar, including a pressure-controlled variable temperature system that controls the pressure of the liquid nitrogen liquid surface in the test Dewar and a system that attaches a heating plate at the cold end to realize variable temperature testing through heat compensation. Among them, the pressure-controlled variable temperature system The system needs to be equipped with a pressurization system and a vacuum system, which are costly, complex in structure, inconvenient to operate and low in test efficiency; systems that realize variable temperature testing through heat compensation can only achieve variable temperature control above the liquid nitrogen temperature (77K), and cannot realize liquid nitrogen Low temperature performance test below temperature

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